Industry News | 2012-04-21 08:45:42.0
Count On Tools Inc. (COT), a leading provider of precision components and SMT spare parts, introduces the new ezLOAD flex PCB Support System
Industry News | 2012-10-31 15:53:31.0
B revision of IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies. This important industry standard is a joint effort of IPC — Association Connecting Electronics Industries® and the Wire Harness Manufacturer’s Association (WHMA).
Industry News | 2018-03-22 21:11:24.0
Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.
Industry News | 2010-03-27 19:26:29.0
BANNOCKBURN, Ill., USA, - IPC - Association Connecting Electronics Industries® announces the products that will be featured in the Innovative Technology Center (ITC) at IPC APEX EXPO™, April 6–8, 2010, in Las Vegas. Assessed by an IPC Review Board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
If you have boards requiring high tolerance mechanical dimension or odd shapes that traditional depaneling methods cannot handle. BEST Inc. provides laser depaneling services for printed circuit board manufacturers as well as EMS and OEMs. BEST’s nu
New Equipment | Solder Paste Stencils
For the DIYer, hobbyist or technical researcher there are times where all you need is a simple means to apply solder paste for SMT devices for a few simple boards. In those cases a plastic SMT stencil may be the right solution. Eliminate the tedious
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.This is a well developed BGA rework method. More on the StencilQuik(TM) process here:
