Electronics Forum | Fri Sep 25 12:53:25 EDT 1998 | Bill Schreiber
Regarding cleaning Chipbonder adhesives from stencils and misprinted PCBs. Check out the Smart Sonic Stencil Cleaning Process at: www.smartsonic.com | | I am looking for anyone out there that has had experience with stenciling with chipbonder adhe
Electronics Forum | Tue Oct 06 09:06:35 EDT 1998 | MMurphy
| I am looking for anyone out there that has had experience with stenciling with chipbonder adhesives. I need information on material and stencil design. Go to the Stencil Design Guidelines page under the Technical Information section of the alphas
Electronics Forum | Fri Jan 24 17:53:42 EST 2003 | razan3
Chipbonder is best applied with a stencil. Too bad on the dispenser purchase. Little hint, use a Kapton Stencil. You can have them laser cut and can get them as thick as you want. Another advantage is the ability to make shapes etc for cleaning
Electronics Forum | Wed Mar 07 12:57:15 EST 2007 | John S.
Hover Davis makes a feeder that can be fitted to many pick and place machines. Runs about 7k. I've seen print on demand feeders at tradeshows for about 30k. If you've got enough volume, you could also laser etch. There's more capital involved, bu
Electronics Forum | Sun Mar 07 13:10:15 EST 1999 | Sam Sangani
| Has anyone used the mechanical stencil foil tensioning system from certain company that eliminates using stencil frames and epoxy & mesh? Any comments on whether it's worth looking into? We go through product revisions like we go through clean so
Electronics Forum | Tue Feb 26 21:23:21 EST 2008 | davef
Several methods are available for singulating or extricating individual flexible circuits from a processed panel; this discussion of the topic applies to all types of flexible circuits. In general, the methods for singulating flex circuits can be bra
Electronics Forum | Fri May 11 14:54:38 EDT 2012 | stentech
I am not aware of the Nano protek flaking off. However I do believe it can wear off through abrasion. Unforunately there is no red light goes off when it has worn unless you have good paste inspection. Even when it wears it will not take you to a neg
Electronics Forum | Fri Sep 08 21:49:24 EDT 2017 | sbar5781
Hello, I have a few PCB boards i am trying to be manufactured that are miniaturized medical devices. Thus they require IPC Class 3 Specs. However as miniature devices they have limited space, including a 0.4mm pitch BGA socket, which currently has
Electronics Forum | Mon Jun 25 20:37:14 EDT 2001 | davef
You are 100% correctamundo that the pad on PCB should be the same as the pad on the BGA interposer, but let�s not expend that thinking to the aperture of your solder paste stencil, right away. Generally, paste on large pitch BGA is often 1:1, but as
Electronics Forum | Mon Jul 16 21:25:26 EDT 2001 | davef
Sure, use of U-shape apertures is another way to reduce the amount of paste that you apply. That and similar schemes mentioned in the article are not a function of the flux used. We have used U-shaped apertures for MELF and mini-MELF. They are sug
