Industry News | 2010-10-07 11:53:52.0
Cencorp Corporation strengths its position as a technology leader in laser integration and automation development with the appointment of Henrikki Pantsar as Cencorp’s new Director of Research and Development.
Industry News | 2023-01-23 18:25:10.0
StenTech® Inc. is pleased to announce the opening of its newest facility in Huntingdon Valley, Philadelphia. The new facility offers local support, manufacturing of Laser cut Stencils and Laser Welded Steps. The Philadelphia facility also features the Advanced Nano coating, proven to be the best coating in North America.
JX-100LED | Compact LED Assembly Compact High Speed Mounter for LED placement at low cost. Compact but with 800×360 mm long board size capacity, the JX-100 LED is a low cost placement solution for notebook PCs, LCD monitors, and a wide variety of l
New Equipment | Industrial Automation
Sales Manager: Sandy Lin Email: unity@mvme.cn Skype: onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC, M
New Equipment | Industrial Automation
Sales Manager: Sandy Lin Email: unity@mvme.cn Skype: onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC, M
Industry News | 2021-11-03 13:33:10.0
Laserssel Co., LTD is pleased to announce that it received two 2021 Mexico Technology Awards in the categories of Bonding Equipment for its LCB 3000 Laser Compression Bonder and Rework & Repair for its Laserssel rLSR Mini LED Rework System. The awards were announced during a ceremony that took place Wednesday, Nov. 3, 2021 during SMTA International in Minneapolis, MN.
Events Calendar | Wed Jun 21 00:00:00 EDT 2017 - Sat Jun 24 00:00:00 EDT 2017 | Bangkok, Thailand
Assembly Technology Expo
New Equipment | Solder Materials
8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr
Industry News | 2001-02-26 11:18:45.0
Innovative Flextac Stencils simplify BGA rework. These self-sticking laser cut, polymer solder paste stencils use a residue-free adhesive similar to Post-it Notes to seal around BGA pads to ensure that solder paste will not bleed under the stencil when the paste is applied. Disposable Flextac Stencils are easy to use and will not leave any residue on the board surface.
Industry News | 2013-11-21 14:41:55.0
A step stencil is an SMD stencil made with local depressions (step-down) or raised areas (step-up) to allow the solder paste volume to be varied locally. This allows for mounting of both SMD components with a low pitch and robust connection components on PCBs in a single step.
