Industry Directory | Consultant / Service Provider / Manufacturer
Electronic manufacturing services - electronic design, development and manufacturing. Circuit board design, prototyping, FPGA services, signal integrity and simulation, pcb assembly. Factories in California USA and Malaysia.
We have been involved in risk management consultancy for over thirty years. We provide an independent perspective supported by a strong science and engineering background. Our approach is founded upon an integrated approach to managing risks.
New Equipment | Education/Training
Blackfox’s Lead Free Soldering series minimizes the risks of conversion, and gives you the confidence to introduce lead free products and services quickly, with highest quality. The lead free certification program offers the latest requirements for S
The OmniES™ is proven to exceed lead-free profile requirements and delivers efficient high performance thermal processing. IsoThermal™ Chamber Technology The OmniES offers a combination of innovation and industry-proven technologies in
Electronics Forum | Thu Jul 25 10:52:26 EDT 2002 | waynesmith
I've been tasked with increasing the CCA throughput in our Conformal Coating workcenter. My first approach will be to look into a more *automated* approach for the masking process. We currently use a manual method of using masking tape prior to con
Electronics Forum | Thu Sep 21 12:10:16 EDT 2000 | Boca
On the money as usual! (Your subtle approach is something to behold. Much like my approach, which has gotten me into more grief over the years than I should be allowed to have.) Boca
Used SMT Equipment | In-Circuit Testers
High Performance Timing Analyzer The DTS-207x Series Digital Time Scope (DTS) is designed for applications where timing accuracy is critical. The DTS provides direct, real-time measurements without the associated errors during the sampling and tran
Used SMT Equipment | General Purpose Test & Measurement
LitePoint IQnxn WiFi MIMO R&D Test Solution features multiple, synchronized vector signal analysis (VSA) and vector signal generator (VSG) instruments designed to characterize and test the latest MIMO WiFi (802.11n) products. The flexible system al
Industry News | 2021-11-08 14:38:39.0
Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022.
Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Parts & Supplies | Assembly Accessories
Supply Omron approach switch.E2E-X1R5E1-M1G、E2E-X2ME1-M1G、E2E-X2E1-M1G、E2E-X5ME1-M1G、E2E-X5E1-M1G、E2E-X10ME1-M1G、E2E-X10E1-M1G、E2E-X18ME1-M1G、 E2E-X1R5F1-M1G、E2E-X2MF1-M1G、E2E-X2F1-M1G、E2E-X5MF1-M1G、E2E-X5F1-M1G、E2E-X10MF1-M1G、E2E-X10F1-M1G、E2E-X18M
Parts & Supplies | Adhesive Dispensers
....番号 Ref.No. 部品コード Parts Code 部品名 Parts Name Serial No. 個数 Q'ty 備考 Remarks 同期 Repl. 53 2-693-662-01 .-........... -. PLATE, CABLE RELAY 1 54 2-693-664-01 ........ -... -COVER, HEAD CONNECTOR 1 55 2-693-665-02 ........ -... -
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2019-07-19 10:21:14.0
One of the most frequently asked questions of ACI Technologies (ACI) is how to qualify and verify that the electronic systems shipped by their respective companies are Restriction of Hazardous Substances (RoHS) compliant. The RoHS directive has been implemented since July of 2006, and the preoccupation with what constitutes a compliant product continues to confuse the electronic industry. ACI receives countless inquiries regarding how to qualify and verify that the electronic systems shipped by the irrespective companies are RoHS compliant. The approach to proving compliancy requires a sequential analytical process that utilizes a decision flow chart.
Unsurpassed cleaning, high-efficiency drying, low cost of ownership, ease of maintenance, and minimum downtime all come together in the ELECTROVERT Aquastorm, a world-class printed circuit board cleaning system. As high-reliability PCBs become minia
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Events Calendar | Thu Mar 18 00:00:00 EDT 2021 - Thu Mar 18 00:00:00 EDT 2021 | ,
India Chapter Webinar: PCBA Process Qualifications
Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | ,
Webinar: BGA Reballing - Theory and Hands On
Career Center | , Arizona USA | Engineering,Production
Position requires an Engineering degree with 4 years experience with SMT equipment preferably FUJI. Programs equipment, maintain profiles, defines process, tooling and standards. Recommends and implement cost reduction approaches.
Career Center | Rancho Santa Margarita, CA USA | Production,Quality Control
Will provide details of circuit card assembly (CCA) troubleshooting results to drive manufacturing process and supplier improvements. Provide technical support for reliability testing. Assist in investigations to resolve field or process defect or pr
Career Center | chennai, tamil nadu India | Production
good communication skil Positive approaches and thinking Self-motivated with strong inclination towards learning. Creative with effective interpersonal skill and organizational abilities
Career Center | Gurgaon, India | Engineering,Management,Production,Purchasing,Quality Control
1. Quality Function Management • Ensure timely inspection at incoming, in-process & outgoing stage. • Non-conformance review & reporting. • Decision making - Right disposal of Non-conforming material. • Determination of Vendor Quality rating (VQR
| https://fluxconnectivity.com/how-flux-connectivity-practices-a-lean-approach-to-business%EF%BB%BF/
How Flux Connectivity Practices A “Lean” Approach To Business Solutions FluxLab™ Contract Manufacturing Labor Optimization Integrated Solutions Products Company Mission
