Electronics Forum | Thu Nov 13 10:05:18 EST 2014 | grimus
Hello, I'm fighting with problems of random solder balls that appears after reflow soldering around Pin in Paste component. I'm mounting this component with Pick and Place machine. I'm using solder paste type-3 and this is lead free product. This is
Electronics Forum | Thu Aug 05 11:15:39 EDT 1999 | John Thorup
| | | | | | | | | Hello, | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chip compon
Electronics Forum | Thu May 17 07:36:40 EDT 2001 | Bob Willis
Here is a copy of a draft document on PIHR Inspection I have jotted down on a flight to Scotland yesterday, any comments suggestions etc ? I have already most of the photos for the standard but as you know there is nothing in the IPC document it just
Electronics Forum | Thu Aug 05 12:20:06 EDT 1999 | John Thorup
| | | | | | | | | | | | | | | Hello, | | | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem
Electronics Forum | Fri Oct 27 10:35:36 EDT 2000 | Chris
We are having problems soldering this motorola part(XPC860TZP50B5). After reflow, some of the balls appear to be sitting on the reflowed paste rather than wetted to it. We reviewed parts and found oxidation on many. We have four other BGA's, from oth
Electronics Forum | Tue Apr 27 17:37:30 EDT 2004 | Ren�
We have switched over form Indium's nc-smq92 to > nc-smq92j and are experiencing a ton of solder > balls. Even if the print is dead on we still seem > to be getting them. We never seemed to have this > problem with old paste unless the print was
Electronics Forum | Thu Aug 05 11:51:44 EDT 1999 | Wolfgang Busko
| | | | | | | | | | | | Hello, | | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chi
Electronics Forum | Thu Jun 25 18:28:23 EDT 1998 | Earl Moon
| Looking for articles/data comparing the quality/reliability of mass | reflowed SMT solderjoints versus hand soldered SMT solderjoints. As solder joint quality most often is subjective - that is visually compared with graphic examples, IPC is the B
Electronics Forum | Thu Aug 05 10:55:09 EDT 1999 | Wolfgang Busko
| | | | | | Hello, | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same problem with chip components but
Electronics Forum | Mon Jan 17 13:09:12 EST 2000 | Dennis _F
We seem to have voids show up in one out of 5 BGAs during x-ray inspection. The x-ray is set up to accept the joint with anything less then 30% void area. I need anyones input of what during the process we can do to decrease the voiding and/or a good
