Electronics Forum | Fri Jun 20 09:38:56 EDT 2003 | caldon
Hi John- First, I do not have first hand experience so my input is pure theory. This type of package (in Some Cases) has a center grounding bonds and leadless legs ups the difficulty tremendously. With no stand-off from the Balls(or Legs) when the so
Electronics Forum | Fri Apr 23 07:50:50 EDT 2004 | smtpro
We have switched over form Indium's nc-smq92 to nc-smq92j and are experiencing a ton of solder balls. Even if the print is dead on we still seem to be getting them. We never seemed to have this problem with old paste unless the print was way off. Is
Electronics Forum | Fri Dec 10 11:22:50 EST 2004 | rlackey
Hi, We paid �60K for a 6622C from Vitronics Soltec, no idea about US costs since the dollar went down the swanny. Great machine though. Not all lead free ovens come with Nitrogen capability - it depends whether you specify it or not, and it can ad
Electronics Forum | Tue Sep 14 17:10:54 EDT 2004 | Jeff, jjg6@agere.com
USE JEDEC Specification EIA/JESD22-B102-C Procedure: 1. Stencil print BGA solder paste pattern onto ceramic substrates 2. Carefully and accurately P&P BGA devices onto the dispensed solder paste pattern to avoid smearing the solder paste. 3. R
Electronics Forum | Thu May 31 10:21:16 EDT 2001 | davef
On "Flip Chip/uBGA Under-fill Visual Standards" � The third "Satisfactory" [The under-fill if by design should be visible � ], here the notation "if by design" is unclear. Does "according to product documentation" get to the point? The first "Acc
Electronics Forum | Wed Dec 09 10:02:10 EST 1998 | Earl Moon
| Does anybody out there have any special insights into utilizing no clean paste in high frequency RF applications? I would imagine there may be some issues with solder balls that would affect functional test (Earl, do you have something for me here?
Electronics Forum | Fri Aug 06 06:13:37 EDT 1999 | Wolfgang Busko
| | | | | | | | | | | | | | | | | | Hello, | | | | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same
Electronics Forum | Mon Feb 21 03:35:38 EST 2005 | abhirami
Thanks Grant and Dave. I have done extensive work on this and found some of the solder balls and solder flux does match my requirements. We have done many tests and have a good responses for both ceramic and plastic substrates. All is fine as long a
Electronics Forum | Sun Apr 25 11:37:51 EDT 1999 | Earl Moon
| We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are using
Electronics Forum | Mon Nov 27 17:47:23 EST 2000 | Dave F
Gyver: Lemme take a wack [if you�ll excuse the expression, given direction of the later discussion] at your questions. Q1. Will the baking of BGA or PCB cause more oxidation before the SMT process? A1. It certainly will not cause less oxidation,
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