Electronics Forum | Wed Dec 08 11:26:04 EST 2010 | davef
3 Printer Area Conditions * As stated earlier, heat and humidity are damaging to solder paste. Ideally, the printing area should be maintained at 40% - 50% relative humidity and 72°- 80°F (22-26°C). In addition, no air (cool or warm) should blow dire
Electronics Forum | Tue Dec 22 14:29:08 EST 1998 | Earl Moon
| | I have a mixed technology board ranging from 50 mil pitch devices to 20mil Qfp's to PBGA-352 at 1.27mm, and 6 Intel uBGA-48 at 30 mil pitch. With all these different package types i'm torn between using a 4 or 5mil thick stencil. The ball dia. is
Electronics Forum | Mon Oct 06 08:51:26 EDT 2003 | davef
The EIA does not provide that information. EIA standards focus on component dimensions. Alternately consider: ...cut... SM-782A - Surface Mount Design & Land Pattern Standard, Inc. Am. 1 & 2 ANSI Approved Get up-to-date land pattern recommendat
Electronics Forum | Tue Apr 13 20:57:14 EDT 2004 | Mike Konrad
Hey Dreamy, Dave is correct. If you attempt to clean your water soluble (OA) flux with water only, you will turn the no-clean flux white. No inspector or end-user will accept this. If a proper cleaning system is not available to you, then I would
Electronics Forum | Fri Feb 11 13:02:01 EST 2011 | deanm
Thank you for all who read this with interest and especially those who replied. I have considered the points posted and here is what we came up with: We all agree that double inspection is a wasteful operation especially if the operator is more crit
Electronics Forum | Wed May 27 11:13:38 EDT 1998 | Justin Medernach
| | | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | | | Earl Moon | | | Earl: We send the BGAs to a service "re-baller." Dave F | |
Electronics Forum | Sun May 02 19:09:46 EDT 1999 | JohnW
| | | Ok folk's has anyone used Alpha Metal's UP78 solder paste ? | | | | | | Our place is looking to move to that as the way to go, getting rid of the Hereaus 362's and Alpha 737's of the current set up. | | | | | | My question's are really : | |
Electronics Forum | Sun Apr 25 17:30:25 EDT 1999 | Mohammad Yunus
| | | | We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are
Electronics Forum | Sun May 02 11:53:43 EDT 1999 | Chrys Shea
| | Ok folk's has anyone used Alpha Metal's UP78 solder paste ? | | | | Our place is looking to move to that as the way to go, getting rid of the Hereaus 362's and Alpha 737's of the current set up. | | | | My question's are really : | | how is the
Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis
Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in
