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Eliminating Latency in Next Gen WiFi 6E Devices

Industry News | 2020-11-04 09:13:07.0

Advanced High-Q RF components will play a critical role in larger goal of eliminating many of the latency issues of the past

Johanson technology

Valor Opens New Sales Office in Taiwan

Industry News | 2001-10-12 06:18:13.0

�Supporting electronics manufacturing efficiency and cost reduction

Valor Computerized Systems

DEK�s New Instinctiv� V9 Software Advances with HawkEye� Control

Industry News | 2008-03-20 21:06:04.0

First unveiled at the end of 2007 during Productronica, DEK�s Instinctiv� V9 machine control software has now added more functionality since its initial debut. The award-winning user interface now incorporates enhanced control of its revolutionary HawkEye� post-print inspection technology, making paste on pad verification even faster and easier.

ASM Assembly Systems (DEK)

Everett Charles Technologies� Gemini Kelvin Spring Pins Named as VISION Award Fist Finalist

Industry News | 2008-04-08 01:21:01.0

Pomona, CA - Everett Charles Technologies (ECT) Semiconductor Test Group (STG) announces that its Gemini Kelvin spring probe was named as a first finalist in the category of Testing during the VISION Awards announcement ceremony that took place Wednesday, April 2, 2008 in Las Vegas during APEX 2008.

Everett Charles Technologies

Henkel Launches Next-Gen Underfill that has it All

Industry News | 2009-05-26 18:16:29.0

In a remarkable breakthrough for underfill materials development, Henkel has engineered and launched a new underfill system that delivers on an unprecedented array of complex and demanding requirements, including room temperature fast flow, low temperature cure and reworkability. The new material, Hysol� UF3800�, has been specifically designed for use with today's CSP and BGA devices and is particularly well-suited for handheld communication and entertainment applications.

Henkel Electronic Materials

DEK Raises the Bar on DirEKt Coat™ Technology

Industry News | 2009-08-10 20:22:02.0

2@+/- 12.5µm and a 7µm Total Thickness Variation (TTV), DirEKt Coat wafer coating processes effectively address the needs of current and future thinned wafer products.

ASM Assembly Systems (DEK)

Production Solutions Appoints Speedline Asia as Asia Pacific Master Distributor

Industry News | 2009-08-17 21:47:54.0

POWAY, CA — August 2009 — Production Solutions Inc., a leading engineering, design and manufacturing company, announces that it has entered into an OEM and distributor agreement with Speedline Technologies Asia Pte Ltd., a global leader in process knowledge, services and manufacture of capital equipment used in printed circuit board assembly and semiconductor industries, to distribute its complete line of RED-E-SET products and technologies.

Production Solutions

Sanmina-SCI Takes Major Steps to Meet the Critical Needs of India's Burgeoning Electronics Market

Industry News | 2010-12-07 19:49:30.0

Sanmina-SCI Corporation today announced its India Design Center is providing significant advantages to Original Equipment Manufacturer (OEM) customers in the multimedia, communications, renewable energies and medical markets.

Sanmina-SCI

Nihon Superior to Exhibit Advanced Soldering Materials at INTERNEPCON JAPAN 2011

Industry News | 2011-01-14 13:06:07.0

Nihon Superior Co. Ltd. will exhibit in Booth # East 30-14 at the upcoming INTERNEPCON JAPAN, scheduled to take place January 19-21, 2011 at the Tokyo Big Sight in Tokyo, Japan.

Nihon Superior Co., Ltd.

Nihon Superior to Showcase Advanced Soldering Materials at IPC APEX EXPO 2011

Industry News | 2011-03-14 17:59:18.0

Nihon Superior Co. Ltd. will exhibit in Booth #259 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.

Nihon Superior Co., Ltd.


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