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Parts & Supplies | Pick and Place/Feeders
Hot sell JUKI ATF FEEDER SPARE PARTS SWING PLATE 12FS ASM E3106706AAA Original new Supply all juki spare parts at low price JUKI E9332721AA0 SEAVO POWER TRUNK CABLE ASM. FUJINTAI TECHNOLOGY CO.,LTD JUKI E93327250A0 TRUNK CABLE ASM. www.fujinta
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Parts & Supplies | Pick and Place/Feeders
Hot sell JUKI ATF FEEDER SPARE PARTS SWING PLATE 12FS ASM E3106706AAA Original new Supply all juki spare parts at low price JUKI E9332721AA0 SEAVO POWER TRUNK CABLE ASM. FUJINTAI TECHNOLOGY CO.,LTD JUKI E93327250A0 TRUNK CABLE ASM. www.fujinta
New Equipment | Cable & Wire Harness Equipment
Overview Microscope for visual analysis of cross-sectional images of crimped connections. Precise results in real-time Simple connection and installation with standard PC Clear illumination with LED ring light Analysis according to
New Equipment | Tape and Reel Equipment
For over 15 years, Mid America has been leading the industry evolution to larger reels, 15 and 22 inch. This is driven from the desire for increased placement efficiency and reduced changeover time, resulting in significant cost reductions. The 15 in
Career Center | San Diego, California USA | Engineering
Kodak - A Design & Product Testing Engineer is responsible for oversight of ink jet printer projects being conducted by the Testing and Customer Assurance area. Oversight includes assurance of the data integrity as well as effective collection, redu
TR7500 SIII CI brings easy Conformal Coating Inspection that combines a multi-camera optical design with specialized multi-phase lighting to inspect UV-active Conformal Coatings. Included angle view cameras ensure the TR7500 SIII CI identifies even t
Industry Directory | Manufacturer
Located in an area which offers low costs and access to a highly skilled, productive and cost-effective labour pool we provide flexible manufacturing services with a true customer-centric philosophy.
Technical Library | 2018-02-28 22:28:30.0
Circuit functional density requirements continue to drive innovative approaches to high performance packaging. Some new approaches include; aggressive space reduction, embedded solutions, and those that offer some form of risk reduction and rework potential are now options that are being explored by customers. Requirements for assembly of these types of packages necessitate the deposition of solder paste and assembly of components into cavities of the substrates to gain z-axis density as well as area functional density. Advances in the fabrication of PWB’s with cavities using newly developed laser micro-fabrication processes along with increased circuit pitch density of 50 micron lines and spaces permit new applications for high performance electronic substrates. First published at SMTA Pan Pacific Symposium
SFG Electronic Technology Co.,Limited Contact:Andy Tung Cell phone/WhatsApp/Wechat:+86 13751093139 Skype:kelvin-andy High-speed insertion at 0.14 s/component Lead V cut method enables the machine to insert radial lead components at a speed of
Career Center | Woburn, Massachusetts USA | Engineering
Candidate will provide technical support to PCB production areas. Responsibilities will include writing process procedures and monitoring process controls. Candidate will conduct materials analysis/testing and participate in new equipment identi
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