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Bondjet BJ931 - High Speed Fully Automatic Dual-Head Wedge Bonder

Bondjet BJ931 - High Speed Fully Automatic Dual-Head Wedge Bonder

New Equipment | IC Packaging

The Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder meets the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specia

Hesse Mechatronics

New Dual-Head Wedge Bonder Makes Americas Debut

Industry News | 2013-06-07 14:37:14.0

Hesse Mechatronics will introduce and demonstrate the new Bondjet BJ931L in booth 6081 in the North Hall at SEMICON West, taking place July 9-11 in San Francisco.

Hesse Mechatronics

ASM Siemens 03062799S02 ASM Pick And Place Machine RV Camera Type  Wires For Chip Mounter

ASM Siemens 03062799S02 ASM Pick And Place Machine RV Camera Type Wires For Chip Mounter

Parts & Supplies | Chipshooters / Chip Mounters

There is stock for sale. If you are interested, please contact us for a quotation by email. Email: info@qosmt.com

QOSMT Co., Ltd.

Hesse Mechatronics Launches Heavy Wire and Ribbon Bonding Services for Early Stage Product Development

Industry News | 2013-05-06 18:13:00.0

Hesse Mechatronics will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder at the company’s west coast demonstration and applications lab, located at long-time company manufacturer's representative Chalman Technologies in Anaheim, California.

Hesse Mechatronics

ASM Siemens AEROLED

ASM Siemens AEROLED

Used SMT Equipment | Semiconductor & Solar

Standard Machine features and system description: Ultra-fine pitch and small ball bonding capabilities High frequency transducer operating at 138 kHz Applicable wire size of 0.6mil-2.0mil High speed XY table with linear motor technology High ac

LEL Tech

Hesse & Knipps To Discuss "Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications" at SMTA Philadelphia Chapter Meeting

Industry News | 2012-05-30 13:50:20.0

Hesse & Knipps GmbH will discuss “Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications” at the SMTA Philadelphia Chapter Meeting.

Hesse Mechatronics

R&D technician

Career Center | San Jose, California USA | Research and Development

Description: Join this team focused on RF Front End Modules (FEM) for the Cellular and Wireless Data markets.  You will be part of the Packaging and Assembly team, and support multiple R&D design teams within the Semiconductor Division (WSD) of Avag

Avago Technologies

STI Capabilities

STI Capabilities

Videos

The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to

STI Electronics

Juki HOSE NIPPLE PJ032052503

Juki HOSE NIPPLE PJ032052503

Parts & Supplies | SMT Equipment

JUKI HOSE NIPPLE PJ032052503 We supply Smt Machine spare parts for JUKI KE750,760,2000,2010,2020,2030,2040,2050,2060,2070,2080,FX-1,etc machines nozzle, Feeder, CPU Board, IO Board, Laser, Cable, Feeder cart, Motor, Driver ect JUKI HOSE

Jinchen Electric Technology Co,.Ltd

Juki Smt Machine O-RING 40042257

Juki Smt Machine O-RING 40042257

Parts & Supplies | SMT Equipment

JUKI Smt Machine O-RING 40042257 We supply Smt Machine spare parts for JUKI KE750,760,2000,2010,2020,2030,2040,2050,2060,2070,2080,FX-1,etc machines nozzle, Feeder, CPU Board, IO Board, Laser, Cable, Feeder cart, Motor, Driver ect   Product

Jinchen Electric Technology Co,.Ltd


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