Electronics Forum | Mon Jul 30 18:52:43 EDT 2001 | Brian W.
You did not provide the stencil thickness or your aspect ratio. If your aspect ratio (Aperture width/stencil thickness) is less than 1.5, the paste will not release correctly from the aperture, leaving paste in the aperture. For example, if your pa
Electronics Forum | Fri Apr 05 12:09:51 EST 2002 | davef
Conductive Silver Epoxy Holefill Process Dupont CB100 (Note: Dupont Recommendations) * Board Thickness: 0.008" to 0.085" * Drilled Via Size: 0.008" to 0.018" * Aspect Ratio: 1:1 to 6:1 On learning more, try: * http://www.ipc.org/html/S17-4a.pdf * Du
Electronics Forum | Mon Jun 25 20:37:14 EDT 2001 | davef
You are 100% correctamundo that the pad on PCB should be the same as the pad on the BGA interposer, but let�s not expend that thinking to the aperture of your solder paste stencil, right away. Generally, paste on large pitch BGA is often 1:1, but as
Electronics Forum | Wed May 22 12:32:49 EDT 2002 | pwrgroup
which stencil vendor can deliver aspect ratio and area ratio and the statistical information to the user?It's difficult if the pad is modified.
Electronics Forum | Mon Jun 30 19:52:39 EDT 2003 | Mark Coplan
If you would email me your aperature ratio on the excell spreadsheet I would be most grateful Thanks, Mark
Electronics Forum | Wed Jun 27 21:16:20 EDT 2007 | rfrog
5 mil will treat you just fine. Do some research on stencil area ratio and aspect ratio if you ever reduce your aperture sizes any further.
Electronics Forum | Wed Jul 24 17:25:01 EDT 2019 | davef
Your solder stencil design should follow all basic rules for solder stencil design are followed in accordance with IPC-7525 including adherence to an area ratio of 2:3 or greater and an aspect ratio of 1.5 or greater.
Electronics Forum | Sun Mar 24 09:20:15 EDT 2024 | yannick_herzog
Hello, does anyone have any experience or can make recommendations for software that allows DFM and DRC to be carried out? Mainly in stencil design (Aspect Ratio and Area Ratio). Greetings Yannick
Electronics Forum | Tue Jul 31 00:48:55 EDT 2001 | Frank
Sorry I forgot to provide enough information. Stencil thickness is 6 mil Aperture width is 10 mil Aspect ratio (aperture area / wall area) = 0.72 Solder paste mesh size, type 3 (-325 +500) With this aspect ratio we can printing without any probl
Electronics Forum | Thu May 18 10:20:55 EDT 2006 | slthomas
Russ asks good questions and I think Chunks pretty much nailed it. Aspect ratio (aperture width/stencil thickness) s/b 1.2 minimum (I like 1.5 if I can get it). If your aperture width = lead width (.008"), yours is 1. Tough to get consistent paste r
