Electronics Forum | Tue May 03 23:27:03 EDT 2016 | adamjs
I've successfully refrigerated a pasted board, and placed/reflowed it the next day with minimal issues. Me too. I'm looking for more than one day. > You might want to invest in a stencil cleaner Tried that. They do not work on the high-aspect ra
Electronics Forum | Mon Oct 14 14:11:39 EDT 2013 | island2013
Yes, I agree with Evtimov. It's more about aperature reduction and type than it is the type of machine. Aspect and and Area Ratio are very important. Take a look at this page I found on the internet http://www.qualiecocircuits.co.nz/stencil-techno
Electronics Forum | Tue Oct 10 12:56:15 EDT 2000 | Ken Van ZIll
I agree that homplate is a good design, but also this could be caused by the stencil thickness and aperture size, if you are at 7-9 mils thick stencil and a 1:1 ratio on aperture size then 2 things i know of will happen, one a squishing out of past o
Electronics Forum | Fri Sep 17 14:30:06 EDT 2004 | russ
You are right, playing with apertures is how to ensure release. Making a stencil thinner or thicker is "playing with apertures" It all relates to aspect and area ratio calculations and what you need to do based upon the numbers you get. Russ
Electronics Forum | Tue Oct 20 11:37:38 EDT 1998 | Stefan Witte
All SM machines pick components with a vacuum nozzle. Most likely the component is picked in the geometric center, which may not be the center of gravity ( SOT 23, SO 89 ). Any other pick position than the center may be taught upon requirement, but y
Electronics Forum | Sat Mar 31 08:22:42 EDT 2007 | davef
Are you observing stencil design rules with regard to aspect and area ratios? For more: * IPC-7525 - Stencil Design Guidelines * A previous discussion http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=24848 * Other postings on stencil ratio
Electronics Forum | Mon Aug 30 04:08:51 EDT 1999 | Earl Moon
| | Planning to evaluate the above process... | | Can anyone can give me some tips/infos on the above.... | | e.g. stencil aperture design, aperture ratio, common problems and solutions they encountered on the above process, is the profile different
Electronics Forum | Mon Apr 12 15:52:12 EDT 2004 | wgaffubar
I am using Indium 92J type 4 solder paste due to a BGA site with .008" pads and stencil opening of .009" square and .005" stencil thickness. When I try the type 3 we get insuffecient print. The aspect ratio tells me that I should be using a type 4. T
Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr
My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone
Electronics Forum | Sat Dec 01 13:43:51 EST 2012 | anvil1021
Do you mean the Paste Layer of the Gerber files? If so then you can check for aspect and area ratio of the component apertures (which is determined by the thickness of the stencil) there is an IPC specification for this and it is IPC-7525A I believ
