Electronics Forum | Wed Mar 02 09:06:44 EST 2005 | russ
We use 10% reductions when either the aspect or area ratio will not be affected. We will utilize a 1:1 when necessary. We place a lot of those little Rnets down to 0805 size .5mm pitch and do not see any problems. We use 6 mil stencils almost excl
Electronics Forum | Fri Jun 04 15:04:16 EDT 1999 | Earl Moon
| I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | We've been getting a rash of defects that we call in this company, "insufficient solder in VIA hole." The
Electronics Forum | Fri May 07 18:01:11 EDT 1999 | Bill Schreiber
Just a note about cleaning SMD adhesives. Cleaning does not need to be hazardous. Smart Sonic has a non hazardous process that has been used for over 9 years using a non hazardous detergent that has been certified by the AQMD as a clean air chemist
Electronics Forum | Fri May 07 18:02:37 EDT 1999 | Bill Schreiber
Just a note about cleaning SMD adhesives. Cleaning does not need to be hazardous. Smart Sonic has a non hazardous process that has been used for over 9 years using a non hazardous detergent that has been certified by the AQMD as a clean air chemist
Electronics Forum | Sat Jan 23 13:29:40 EST 1999 | Earl Moon
| Hi Everyone, | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concern
Electronics Forum | Mon May 18 11:39:30 EDT 1998 | Earl Moon
| | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin package
Electronics Forum | Wed Mar 24 23:12:48 EDT 2021 | grahamcooper22
0.66 area aspect ratio...so for example...if the device is 0.5mm pitch QFP, the pcb pad may be 12 thou wide..make the aperture 9 to 10 thou wide...and reduce it's length by 10 % overall compared to the pcb pad.... Depending on device pitch, select ap
Electronics Forum | Tue May 30 21:09:30 EDT 2000 | Dave F
Dennis: Direct metalization is more of an European phenomena than a US one. Not to say that good things don�t come out of Europe. As background: Direct Metallization. In circuit board fabrication, an alternative to electroless plating makes the
Electronics Forum | Mon May 18 11:50:23 EDT 1998 | Earl Moon
| | | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin pac
Electronics Forum | Fri Mar 07 14:09:16 EST 2003 | davef
Q1: What are the recommended stencil apertures for a TSOP40. Lead pitch 0.48mm & lead width 0.21mm. A1: We've talked about this previously here on SMTnet, for instance check the fine SMTnet Archives: http://www.smtnet.com//forums/index.cfm?fuseactio
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