Industry News | 2010-08-10 14:16:50.0
The Electronics Assembly and Packaging Technology Expo 2010 (ATE China 2010) will take place between August 31 and September 2 at the Shenzhen Convention & Exhibition Center. The expo will highlight various types of electronics assembly and packaging facilities, both locally and abroad. It also will offer technical solutions to assembly and production problems and allow buyers to identify new suppliers ― all of which will enhance competitiveness in the industry.
Industry News | 2016-08-17 13:18:12.0
ADLINK Technology introduced its latest network appliance with the most flexible I/O options currently available on the market. With eight NIM (Network Interface Module) slots and five 2.5’’ HDD drive bays, the CSA-7200 offers extended configuration possibilities for the network security market and is our initial network appliance built using MICA (Modular Industrial Cloud Architecture), which enables fast reconfiguration and reduces time-to-market for new applications.
Industry News | 2018-09-06 15:18:14.0
Although many High Q capacitors are available on the market, performance can vary widely depending on design and quality of manufacturing
Electronics Forum | Thu Oct 19 16:10:44 EDT 2000 | John Thorup
Much has been said on this subject. Try a search of the archives for the terms "Phil Zarrow" and "surface tension". You'll likely find what you need.
Electronics Forum | Thu Oct 19 16:10:48 EDT 2000 | John Thorup
Much has been said on this subject. Try a search of the archives for the terms "Phil Zarrow" and "surface tension". You'll likely find what you need.
Electronics Forum | Thu Oct 19 12:34:36 EDT 2000 | lwatson
I can't seem to find an article about the limiting mass of a SMT component on the solderside of a double-sided reflowed PCB. I'm pretty sure that Phil Zarrow did an article on this subject. It went something like the mass/land surface area?
Electronics Forum | Tue Jun 17 02:08:53 EDT 2003 | Bruce
What is the correct formula for Aspect Ratio? Thanks
Electronics Forum | Thu Jul 16 10:40:12 EDT 2015 | migliore
Hi, Question 1: can anyone explain me what the VIA ASPECT RATIO is? Question 2: Let's say that a PCB manufacturer specifies a VIA ASPECT RATIO of 8:1. Can I have vias of drill diameter of 0.1 mm on a 2L board 1.6 thick? thanks, Enrico Migliore
Electronics Forum | Wed Aug 19 19:16:43 EDT 1998 | Steve
How is the aspect ratio of a reliable BGA joint defined? Is it best to have H/W between two limits? What are these?
Electronics Forum | Fri Aug 21 15:03:42 EDT 1998 | Dave F
| How is the aspect ratio of a reliable BGA joint defined? Is it best to have H/W between two limits? What are these? Steve: People on TechNet have spent alot of time talking about BGA pad design. Use the link below. Dave
