Electronics Forum | Fri Mar 20 10:27:58 EDT 2009 | joelperez
Hello, Has anyone dealt with the process of listing the substances on their electronic products due to REACH? I'm trying to find out if there is a way to globally calculate the area ratio of all the apertures on a solder paste stencil so I can calcu
Electronics Forum | Fri Mar 02 10:06:28 EST 2007 | oldsmtdude
Agilent SP50 rocks for continuous improvement and pass-fail efforts. You'll see variation you never imagined you had prior. But be aware you absolutely have to monitor data and tweak your processes to improve results. Do not jump in and try and use
Electronics Forum | Tue Aug 01 10:29:43 EDT 2006 | slthomas
It's been a while since I've built with 16 mil pitch, but I have to second the recommendation to go to 5 mil stencils. Night and day as far as release characteristics. The increase in aspect ratio opens up the window a lot. (read = covers up a mult
Electronics Forum | Wed Apr 14 14:51:10 EDT 2010 | jgalarza
After checking some of our stencil data for the correct aspect ratio I found that a few are wrong. I would like to change them from 5mil thk to 4mil thk but do not know how much paste volume I need to keep. We are using 0201,0402, and BGA with 0.80 p
Electronics Forum | Mon May 24 13:11:12 EDT 2010 | deanm
A guideline that I use agrees with MikeS: For 20mil pitch, apertures should be 9-10mil with a stencil thickness of 5-6mils to achieve an acceptable aspect ratio of 1.7. Just be sure you are using a mesh Type 3 or 4 solder paste. Otherwise, larger par
Electronics Forum | Sat Dec 01 13:43:51 EST 2012 | anvil1021
Do you mean the Paste Layer of the Gerber files? If so then you can check for aspect and area ratio of the component apertures (which is determined by the thickness of the stencil) there is an IPC specification for this and it is IPC-7525A I believ
Electronics Forum | Tue Oct 10 12:56:15 EDT 2000 | Ken Van ZIll
I agree that homplate is a good design, but also this could be caused by the stencil thickness and aperture size, if you are at 7-9 mils thick stencil and a 1:1 ratio on aperture size then 2 things i know of will happen, one a squishing out of past o
Electronics Forum | Fri Jan 10 03:57:37 EST 2020 | jakapratama
Hello, When I calculate based on the data you gave, your stencil aperture area compared to pad area is 94.52%. Your aperture area ratio is 1.76 using 5 mils thickness foil. OK, your stencil and your paste release is not the culprit here. Your proble
Electronics Forum | Tue Jan 16 09:23:26 EST 2001 | P.Gerits
Hello, Standard way to calculate stencil design can be done as follows: A normal ratio of aperture width/stencil thickness = 1.5 for pitches below 650u A normal ratio of stencil aperture width against pad width = 0.8-0.9 (or stencil aperture 10%-20
Electronics Forum | Wed May 30 21:16:05 EDT 2001 | davef
MPM AP-27 preferred over MPM AP-20 The issue is release of paste from the stencil. A vertical lift printer kinda snaps the stencil away from the board to complete the print cycle. The inertia and the rheometric properties of the paste make it rele
