Electronics Forum | Wed Feb 18 14:45:33 EST 2004 | Mauro Pinheiro
I'm looking for a shareware software that I could use for specifying stencils (we are stencil users not manufacturers). I would like to enter some preliminary spec in a software form, such as: the smallest pad geometry on pcb (possibly selected from
Electronics Forum | Wed Jul 13 09:07:32 EDT 2005 | russ
The reason for going 1:1 with lead free is that it does not spread out like the pb solders. So 1:1 is really not necessary in my opinion. We go 1:1 anyway on discrete components along with other packages. You always have to make sure that the area
Electronics Forum | Thu Dec 08 12:24:11 EST 2005 | cyber_wolf
Any good stencil house should be able to recommend the proper configuration on a fine pitch aperture design. They can also advise you as to which foil thickness works best. The norm foil thickness is .005" - .006". There are always special instances
Electronics Forum | Wed Jun 14 09:34:25 EDT 2017 | cyber_wolf
In my experience there is no need for wet wiping stencils. We run 0201'and micro BGA's daily with no issues. If you are having paste release issues, I would be looking at other things. Aperture area aspect ratio, aperture design, land design, sold
Electronics Forum | Thu Aug 29 13:03:13 EDT 2002 | lysik
You have may have already checked this but verify stencil design (aspect ratio) and make sure you are using the correct paste (mesh size) Also look at perint pressure. up to 2 lbs per inch of blade used. You may also want to use a slow break away whe
Electronics Forum | Tue May 22 12:27:04 EDT 2007 | cyber_wolf
I would consider calling Kester and telling them they need to send their people out. I could not really see mesh size being an issue on anything 20mil and above. There are several other issues that can cause aperture clogging as well...: Incorrect
Electronics Forum | Wed Jun 20 07:09:59 EDT 2007 | aj
Hi All, Just a quick question in relation to BGA Stencil Aperture Design - We currently use 1:1 ratio - are there any rules or benefits from over printing the PCB Pad ? Replies appreciated. aj...
Electronics Forum | Fri Mar 02 10:06:28 EST 2007 | oldsmtdude
Agilent SP50 rocks for continuous improvement and pass-fail efforts. You'll see variation you never imagined you had prior. But be aware you absolutely have to monitor data and tweak your processes to improve results. Do not jump in and try and use
Electronics Forum | Tue Dec 17 20:25:13 EST 2002 | iman
Check : 1) design aspect ratio / are ratio required to fabricate the stencil you r using. 2) check if the stencil maker is using your checked aspect ratio / area ratio? if not the same, what are they using? any QA report confirming actual dimension
Electronics Forum | Wed Jun 20 12:07:13 EDT 2001 | Steve
I would suggest getting a copy of IPC-SM-782A, Surface Mount Design and Land Pattern Standard, and IPC-7525 Stencil Design Guidelines. My experience is that reflow does not cause tombstoning very often. Pad and land design, paste volume, and placemen
