Electronics Forum | Sat Dec 08 00:09:24 EST 2012 | jlawson
Mentor(Valor) has dfm softwares that not only looks at the stecnicl layers buy can look at other impacts that could effect the optimisation of the stencil design, ie solder mask layer tolerances defined from fabricator-design etc - this is a upper en
Electronics Forum | Tue Oct 10 12:56:15 EDT 2000 | Ken Van ZIll
I agree that homplate is a good design, but also this could be caused by the stencil thickness and aperture size, if you are at 7-9 mils thick stencil and a 1:1 ratio on aperture size then 2 things i know of will happen, one a squishing out of past o
Electronics Forum | Mon Apr 12 15:52:12 EDT 2004 | wgaffubar
I am using Indium 92J type 4 solder paste due to a BGA site with .008" pads and stencil opening of .009" square and .005" stencil thickness. When I try the type 3 we get insuffecient print. The aspect ratio tells me that I should be using a type 4. T
Electronics Forum | Mon Jul 31 12:59:19 EDT 2006 | slthomas
Nothing like making a handful of changes all at once to confuse an issue, huh? Did you (or whomever ordered the stencil) spec. the same stencil design parameters that you would normally have used? We've never done fine pitch of any sort on silver
Electronics Forum | Tue Mar 21 02:15:26 EST 2006 | pavel_murtishev
Good morning Dave, Here are some of my assumptions. Please correct me if I am wrong. 1. Mask opening. Due to mask to PCB misregistration mask is not always centered relative to pad center how is should be. Sometimes edge of the mask matches with ed
Electronics Forum | Wed Jul 22 12:47:23 EDT 1998 | Earl Moon
| I'm trying to put together a set of design guides for use for new designers | in house or to be sent out for contracted layout work. I would like to start with a top ten list of things that will go wrong if rules aren't available. For example testp
Electronics Forum | Thu May 24 08:55:25 EDT 2007 | ck_the_flip
Here's some quick things to look for: 1. Does your solder paste feel like concrete, does it roll-up into your squeegee blades, and stick to your stencil? If so, your problem is the solder paste. The mixture of powder and flux, or metal load is ou
Electronics Forum | Wed Mar 02 09:06:44 EST 2005 | russ
We use 10% reductions when either the aspect or area ratio will not be affected. We will utilize a 1:1 when necessary. We place a lot of those little Rnets down to 0805 size .5mm pitch and do not see any problems. We use 6 mil stencils almost excl
Electronics Forum | Wed Jun 14 12:43:52 EDT 2000 | Todd Murphy
Dave, you are right you would expect the soldermask to be higher than all SMT pads on the pcb if it is higher on the fine pitch components, but the other areas of the board do not concern me as much as the fine pitch areas. The pads on all the other
Electronics Forum | Mon Aug 30 04:08:51 EDT 1999 | Earl Moon
| | Planning to evaluate the above process... | | Can anyone can give me some tips/infos on the above.... | | e.g. stencil aperture design, aperture ratio, common problems and solutions they encountered on the above process, is the profile different
