Industry Directory: aspect ratio stencil design rules (3)

Surface Mount Technology Association (SMTA)

Surface Mount Technology Association (SMTA)

Industry Directory | Association / Non-Profit / Training Provider / Events Organizer

The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.

FP STENCIL SDN. BHD.

Industry Directory | Manufacturer

FP Stencil Sdn. Bhd. is principally involved in the manufacture and sale of laser-cut metal surface- mount technology (SMT) stencils. Our products comprise of PCB stencils, wafer stencils, mini stencils, & accessories.

New SMT Equipment: aspect ratio stencil design rules (1)

DEK ProActiv - Process Technology for Unprecedented Paste Transfer Efficiency

DEK ProActiv - Process Technology for Unprecedented Paste Transfer Efficiency

New Equipment | Printing

ProActiv is a breakthrough process technology that dramatically improves solder paste transfer efficiency with stencil printing. It redefines the boundaries of Area Ratio rules for stencil apertures, which dictate the smallest apertures that can be p

ASM Assembly Systems (DEK)

Industry News: aspect ratio stencil design rules (18)

Technical Library: aspect ratio stencil design rules (2)

CHANGING THE RULES OF STENCIL DESIGN

Technical Library | 2023-05-22 16:42:56.0

Nano-coatings are applied to solder paste stencils with the intent of improving the solder paste printing process. Do they really make a noticeable improvement? The effect of Nano-coatings on solder paste print performance was investigated. Transfer efficiencies were studied across aperture sizes ranging from 0.30 to 0.80 area ratio. Also investigated were the effects of Nano-coatings on transfer efficiencies of tin-lead, lead-free, water soluble, no-clean, and type 3, 4, and 5 solder pastes. Solder paste print performance for each Nano-coating was summarized with respect to all of these variables.

FCT ASSEMBLY, INC.

Via In Pad - Conductive Fill or Non-Conductive Fill?

Technical Library | 2020-07-15 18:29:34.0

In the early 2000s the first fine-pitch ball grid array devices became popular with designers looking to pack as much horsepower into as small a space as possible. "Smaller is better" became the rule and with that the mechanical drilling world became severely impacted by available drill bit sizes, aspect ratios, and plating methodologies. First of all, the diameter of the drill needed to be in the 0.006" or smaller range due to the reduction of pad size and spacing pitch. Secondly, the aspect ratio (depth to diameter) became limited by drill flute length, positional accuracy, rigidity of the tools (to prevent breakage), and the throwing power of acid copper plating systems. And lastly, the plating needed to close up the hole as much as possible, which led to problems with voiding, incomplete fill, and gas/solution entrapment.

Advanced Circuits

Career Center - Jobs: aspect ratio stencil design rules (1)

SMT Manufacturing Engineer - 2nd Shift

Career Center | Houston, Texas USA | Engineering,Management,Production

SMT Manufacturing Engineer – 2nd Shift Hunting Innova is a Houston based company serving industrial, energy, medical, defense and aerospace segments of the Electronic Manufacturing Services (EMS) Industry since 1989.  Hunting Innova is located in N

Hunting Innova

Express Newsletter: aspect ratio stencil design rules (1276)

SMTnet Express June 20 - 2013, Subscribers: 26136

SMTnet Express June 20, 2013, Subscribers: 26136, Members: Companies: 13402, Users: 34820 Low Surface Energy Coatings Rewrites the Area Ratio Rules by: Ricky Bennett; Assembly Process Technologies , Eric Hanson; Aculon With today's consumer

Partner Websites: aspect ratio stencil design rules (11)


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