Industry News | 2016-02-15 17:53:06.0
Viscom will exhibit in Booth #1763 at the 2016 IPC APEX EXPO. Viscom's applications experts will present the company's new 3D AOI and X-ray developments.
Industry News | 2016-02-17 17:43:57.0
Viscom announced today that it will exhibit in Booth #1763 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Viscom’s applications experts will present the company’s new 3D AOI and X-ray developments.
Industry News | 2021-04-21 10:17:09.0
Seoul, South Korea – At the 30th anniversary of NEPCON China, Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions will exhibit a full suite of inspection and process control solutions at NEPCON China in Booth 1H15 Zone A on April 21-23, 2021 at the Shanghai World Expo Exhibition & Convention Centre.
Industry News | 2021-04-29 16:58:08.0
At the 30th anniversary of NEPCON China, Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions will exhibit a full suite of inspection and process control solutions at NEPCON China in Booth 1H15 Zone A on April 21-23, 2021 at the Shanghai World Expo Exhibition & Convention Centre.
Industry News | 2016-06-13 18:56:40.0
Computrol has purchased three KY-8030-3 in-line, fully automated SPI systems from Koh Young Technology.
Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm INQUIR
Industry News | 2016-03-27 14:25:07.0
ViTrox Technologies today announced that it will exhibit in booth #1H21 at NEPCON China, scheduled to take place April 26-28, 2016 at the Shanghai World EXPO Exhibition & Convention Center. ViTrox's new products – V310 3D SPI and V-One – will be highlights of the day along with the proven V810 Mini AXI system.
Industry News | 2009-03-10 13:10:18.0
TORRANCE, CA � January 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will premier Anritsu, a new 3-D High Precision Laser In-Line Solder Paste Inspection System in booth 1035 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.
New Equipment | Test Equipment
SAKI In-line 3D AOI BF-3Di 3D AOI Board size:250×330mm weight:900KG Dimension:850 × 1295 × 1130mm Product description: SAKI In-line 3D AOI BF-3Di, 3D AOI, Board size:250×330mm, Dimension:850 × 1295 × 1130m
Fast automatic inspection and high performance sample testing in one system. Two inspection concepts in one system - The best of two worlds. In modern SMT production, components such as BGA, QFN or QFP are gaining ground. Because their connectors a
Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
Equipment Dealer / Broker / Auctions
Hwaseong-si, Gyeonggi-do, Korea
Hwaseong-si, South Korea
Phone: +82-1029254936
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