Technical Library | 2012-09-13 20:45:17.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. Prior to committing production boards to vapor phase soldering, we performed an evaluation to assess reliability and evaluate the vacuum soldering option. The reliability of vapor
Technical Library | 2014-03-20 12:37:39.0
In the beginning of SMT, Vapor Phase Soldering was the preferred reflow soldering technology because of its excellent heat transfer capabilities. There were also some disadvantages like fast temperature rise, nearly no influence on the temperature profiles and high costs. So the use of Vapor Phase Soldering was reduced to special applications with high mass or complex boards in low numbers (e.g. for military or aerospace use).
Industry News | 2024-02-26 13:50:16.0
Altus Group is pleased to announce notable sales achievements in partnership with ASSCON. Since joining forces in 2021 to bring ASSCON's vapour phase technology to the UK and Ireland, their collaboration has led to significant market penetration and unprecedented year-over-year growth. Driven by increasing demand across key segments, they have seen record-breaking unit sales in 2023.
Technical Library | 2013-03-27 23:43:40.0
Vapor phase, once cast to the annals’ of history is making a comeback. Why? Reflow technology is well developed and has served the industry for many years, it is simple and it is consistent. All points are true – when dealing with the centre section of the bell curve. Today’s PCB manufacturers are faced with many designs which no longer fall into that polite category but rather test the process engineering groups with heavier and larger panels, large ground planes located in tricky places, component mass densities which are poorly distributed, ever changing Pb Free alloys and higher process temperatures. All the time the costs for the panels increase, availability of “process trial” boards diminishes and yields are expected to be extremely high with zero scrap rates. The final process in the assembly line has the capacity to secure all the value of the assembly or destroy it. If a panel is poorly soldered due to poor Oven setup or incorrect programming of the profile the recovery of the panel is at best expensive, at worst a loss. For these challenges people are turning to Vapor Phase.
Adjustable pin chain conveyors, 4 zone preheat section, horizontal reflow position, left to right product flow, touch screen operation, fully integrated controls, SMEMA upstream/downstream interface, bar code capability and all the standard features
Industry News | 2011-09-23 21:12:22.0
R&D Technical Services. announces that David Suihkonen, President, will chair a technical session at the upcoming SMTA International Conference & Exhibition
Industry News | 2016-09-13 20:22:44.0
R&D VaporTech, a subsidiary of IBL Technologies, LLC, today announced that David Suihkonen, Vice President – North America, will present at the upcoming SMTA Dallas September Chapter Meeting, Technical Presentation & Luncheon, scheduled to take place Friday, Sept. 16, 2016. Suihkonen will present “Advances and New Developments in Vapor Phase.” SMTA members, non-members, students and guests are welcome to attend the event, which will be held at Aboca’s Italian Grill in Richardson, TX.
Industry News | 2017-01-17 16:10:44.0
IBL Technologies today announced that it is celebrating its 30-year anniversary in 2017. IBL started in 1987 when Mr. Helmut Leicht started Ingenieurbüro Leicht as an engineering firm. The company moved beyond engineering in 1988 when IBL began manufacturing its first vapor phase soldering systems.
Used SMT Equipment | Soldering - Reflow
REHM Condenso Vapor Phase Reflow Oven Year 2008 Tension: 3 x 400V 50 Hz Power 20 kW Cooling 20 l/m Compressed air 8 bar Aspiration 400 m3/h Length 290 cm, Width 130 cm, Height 165 cm
Used SMT Equipment | Soldering - Reflow
REHM Condenso-Batch Vacuum Vapor Phase Reflow Oven Year 2008 Tension: 3 x 400V 50 Hz Power 20 kW Cooling 20 l/m Compressed air 8 bar Aspiration 400 m3/h Length 290 cm, Width 130 cm, Height 165 cm
