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CirTran Receives Order From U.S. Government Agency

Industry News | 2003-02-27 08:13:16.0

The order was placed through CirTran's wholly owned subsidiary, Racore Technology Corporation.

SMTnet

Northrop Grumman Enters Military Printed Circuit Board Market

Industry News | 2003-04-15 08:39:15.0

Granted supplier qualification by the United States Department of Defense's Defense Supply Center Columbus (DSCC)

SMTnet

SEC Declares CirTran Registration Statement Effective

Industry News | 2003-06-06 08:08:03.0

Company Further Strengthens Financial Position With $5 Million Equity Credit Line

SMTnet

DDI Corp. Provides Update on Negotiations with it's Senior Lenders and Convertible Noteholders

Industry News | 2003-04-04 08:46:37.0

Company Announces Further Reductions to Goodwill and Reclassifications of Indebtedness Recorded in Fiscal 2002

SMTnet

CirTran Receives Multiple Follow-On Orders from Dynojet Research

Industry News | 2003-03-10 08:33:30.0

For the manufacture of Power Commander cable assemblies.

SMTnet

PCB East 2003 Announces Final Conference and Exhibition Program

Industry News | 2003-07-10 08:45:50.0

UP Media Group Inc. today announced the final schedule of events for the eighth annual PCB Design Conference East

SMTnet

MIRTEC to exhibit full line-up of inspection systems that completes the SMT production line at NEPCON ASIA 2019

Industry News | 2019-08-12 20:03:57.0

MIRTEC, ‘The Global Leader in Inspection Technology,’ today announced that it will display its award-winning 3D AOI, 2D AOI and SPI Inspection Systems in booth #1C55 with Mir Tech-win at the upcoming NEPCON ASIA (NEPCON SOUTH CHINA) exhibition, scheduled to take place August 28-30, 2019 at the Shenzhen Convention & Exhibition Center in China.

MIRTEC Corp

Teradyne Introduces Optima 7210 Optical Process Test 'OPT' System

Industry News | 2003-04-02 09:03:49.0

Configural Recognition(TM) Object and Image-Analysis Technology Enables One-Hour Program Generation

SMTnet

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Teradyne Expands Presence in China and Opens Shanghai Facility

Industry News | 2003-03-12 09:10:10.0

As part of the opening celebration, Teradyne will be exhibiting this week at SEMICON China and in April at Nepcon Shanghai.

SMTnet


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