SMD Pick and Place Machines for All Levels of SMT Assembly T8 Product Description 1. What is T8? The homophonic of T8 is Post Hegemony. It is the real” Patch Overlord” in SMT industry in the future. 2. T8 is also the eighth mounting products of T
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Industry News | 2022-02-25 14:40:53.0
The electronics manufacturing industry is applauding a set of U.S. Government reports on strategic supply chains, released today, which highlight the need for the United States to foster a robust domestic electronics manufacturing industry.
Technical Library | 2014-01-02 15:56:55.0
With ROHS compliance the transition to lead-free is inevitable. Several lead-free alloys are available in the market and its reliability has been the main concern. The results from this experimental research aims at making a comparison of different lead-free alloy combinations. Thermal shock and drop tests are a part of this experimental study.
Technical Library | 2022-12-05 16:28:06.0
The work evaluates the impact of latent heat (LH) absorbed or released by a solder alloy during melting or solidification, respectively, on changes of dimensions of materials surrounding of the solder alloy. Our sample comprises a small printed circuit board (PCB) with a blind via filled with lead-free alloy SAC305. Differential scanning calorimetry (DSC) was employed to obtain the amount of LH per mass and a thermomechanical analyzer was used to measure the thermally induced deformation. A plateau during melting and a peak during solidification were detected during the course of dimension change. The peak height reached 1.6 μm in the place of the heat source and 0.3 μm in the distance of 3 mm from the source. The data measured during solidification was compared to a numerical model based on the finite element method. An excellent quantitative agreement was observed which confirms that the transient expansion of PCB during cooling can be explained by the release of LH from the solder alloy during solidification. Our results have important implications for the design of PCB assemblies where the contribution of recalescence to thermal stress can lead to solder joint failure.
Fundamentals of Solder Paste Technology Fundamentals of Solder Paste Technology Solder pastes are key materials in surface mount technology (SMT) for assembly of printed circuit boards (PCBs). Introduction of lead-free has placed new demands
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AA06417 SMT Nozzles V12 1.3 Fuji Nozzle for pick and place machine Basic Information Place of Origin: Japan Brand Name: Fuji Model Number: AA06417 V12 1.3 Minimum Order Quantity
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IPC 620 Compliance of Poke Home - Junction Box - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
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