Industry News | 2022-11-22 06:14:08.0
Full-auto SMT Stencil Printer is indispensable equipment in SMT production Line. It is generally composed of board mounting, solder paste, imprinting, and circuit board transfer. Widely used are Full-auto SMT Stencil Printer and semi-auto SMT Stencil Printer These two types, next, let's share with you the operating instructions of Full-auto SMT Stencil Printer.
Industry News | 2012-10-22 18:41:47.0
IPC and SMTA jointly announce the agenda for Session 3 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.
Industry News | 2012-10-22 18:42:04.0
IPC and SMTA jointly announce the agenda for Session 3 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.
Industry News | 2023-07-22 07:07:57.0
Experience Success: Seamless SMT Production Line Delivery for Greece Security Applications. Discover how our cutting-edge SMT solutions ensure efficient and reliable manufacturing, tailored to meet the demands of security applications in Greece. Optimize your production process, elevate performance, and achieve excellence with our expertly delivered SMT solutions today!
Industry News | 2011-03-28 13:24:06.0
Eleven products have been selected for inclusion in the Innovative Technology Center at IPC APEX EXPO™, April 12–14, 2011, in Las Vegas, according to show organizer IPC – Association Connecting Electronics Industries. Assessed by a review board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Technical Library | 2018-09-26 20:33:26.0
Bottom terminated components, or BTCs, have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations with underside ground/thermal pads have presented a multitude of challenges to PCB assemblers, including tilting, poor solder fillet formation, difficult inspection and – most notably – center pad voiding. Voids in large SMT solder joints can be difficult to predict and control due to the variety of input variables that can influence their formation. Solder paste chemistries, PCB final finishes, and reflow profiles and atmospheres have all been scrutinized, and their effects well documented. Additionally, many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.
Industry News | 2018-10-18 09:56:07.0
What are the Factors Affecting the Cost of PCB Production?
Industry News | 2013-08-30 14:08:29.0
Pickering Interfaces will be showcasing their latest hardware solutions at AUTOTESTCON 2013 Chicago.
Industry News | 2022-02-10 16:53:40.0
The Murray Percival Company is pleased to announce that it has received the 2021 Distributor of the Year award from MicroCare.
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