Technical Library | 2020-12-29 20:55:46.0
Voiding in solder joints has been studied extensively, and the effects of many variables compared and contrasted with respect to voiding performance. Solder paste flux, solder powder size, stencil design, circuit board design, via-in-pad design, surface finish, component size, reflow profile, vacuum reflow, nitrogen reflow and other parameters have been varied and voiding quantified for each. The results show some differences in voiding performance with respect to most of these variables but these variables are not independent of each other. Voiding in solder joints is a complex issue that often requires multiple approaches to reduce voiding below required limits. This paper focuses on solutions to voiding for commonly used bottom terminated components (BTCs).
Industry News | 2012-09-17 14:50:33.0
Kyzenwill present “Under stencil wiping: Does it benefit your process?” at the upcoming SMTA International Conference and Expo,
Industry News | 2015-10-21 20:30:02.0
Gen3 Systems Limited is pleased to introduce a totally new design of the Contaminometer (CM Series Process Ionic Contamination Testers) it will be released in Hall A4, Booth 470 at the productronica International Trade Fair, scheduled to take place Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. Gen3 will be exhibiting alongside its German Distributor, Stannol GmbH.
Industry News | 2018-10-18 10:16:53.0
Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish
Industry News | 2017-04-24 19:14:12.0
Data I/O Corporation will showcase the new ConneXTM smart programming software for PSV systems in Booth #A-1H01 at NEPCON CHINA, scheduled to take place April 25th-27th at Shanghai world EXPO exhibition and convention center.
Industry News | 2023-09-11 17:31:10.0
Heraeus Electronics is pleased to announce its participation at SMTA International, a premier event for electronics manufacturing and assembly professionals. The event is scheduled to take place Oct. 9-12, 2023 at the Minneapolis Convention center in Minneapolis, MN. Heraeus Electronics will present its groundbreaking Microbond® SMT660 Innolot and Microbond® SMT660 Innolot® 2.0 Solder Pastes, and showcase its exceptional sinter paste innovations, including the PE338 Silver and PE401 Copper Pressure Sinter Paste in Booth #1230.
Industry News | 2023-09-25 13:59:04.0
ZESTRON is hosting a live webinar on September 28, 2023, at 2:00 PM EST. This webinar will be given by Sr. Application Engineer, Ravi Parthasarathy, and Brent Frizzell, Global Electronics & Automotive Marketing Segment Manager from Specialty Coating Systems. The event will focus on the criticality of cleaning PCBs before conformal coating and is intended for individuals interested in learning about the benefits of cleaning PCBs, the harmful effects of coating over residues, and the assessment methods used to evaluate cleanliness before conformal coating.
Industry News | 2023-09-25 18:43:04.0
ZESTRON is hosting a live webinar on September 28, 2023, at 2:00 PM EST. This webinar will be given by Sr. Application Engineer, Ravi Parthasarathy, and Brent Frizzell, Global Electronics & Automotive Marketing Segment Manager from Specialty Coating Systems. The event will focus on the criticality of cleaning PCBs before conformal coating and is intended for individuals interested in learning about the benefits of cleaning PCBs, the harmful effects of coating over residues, and the assessment methods used to evaluate cleanliness before conformal coating.
Industry News | 2016-08-28 13:49:20.0
Altus Group, leading distributors of capital equipment for electronics assembly and Accelonix, dominant suppliers of electronic and precision manufacturing and test equipment have partnered to present an innovative technology showcase on 29th September 2016.
Industry News | 2023-01-23 17:40:54.0
STI Electronics, Inc. today announced that David Raby, President & CEO, will participate in the Reliability Matters Podcast during the SMTA Pan Pacific Microelectronics Symposium on Tuesday, Jan. 31, 2023 at 9 a.m. in Kauai, Hawaii.
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