Industry Directory | Manufacturer
I.C.T is a manufacturer from China that offers SMT, DIP, PCBA conformal coating equipment and turnkey solution.
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
New Equipment | Education/Training
PRO-STD-001 Certification Course Schedule Day 1: Advanced Counterfeit Component Detection and Prevention Certification Course, PRO-STD-001, 6 hours. Day 2: Course overview, (4 > Custom Progressive Course This course is taught in two tiers and can
Electronics Forum | Wed Sep 21 16:29:00 EDT 2016 | carlosdugay123
Hi Hamed, We manufacture Thick Film Screens and offer free technical assistance. Please let me know if I can assist you. Carlos Dugay (760) 798-6984
Used SMT Equipment | Screen Printers
DEK 265 GSX Stencil Printer Model Number: GSX Green Camera Under Stencil Cleaner Assist with Vacuum 2D Board Inspection Machine is in Very Good Condition and includes support pins, accessories, and manuals.
Used SMT Equipment | Screen Printers
DEK mod. HORIZON 02i Screen Printer, ser. 286085, 230V 50/60Hz, 06 Full Load Amps, 5-8 Bar Compressed Air Pressure, yr. 2005DEK mod. HORIZON 02i, ser. 286085, 230V 50/60Hz, 06 Ampères à pleine charge, 5-8 Bar de pression d'air comprimé, année 2005.Yo
Industry News | 2016-02-27 22:11:00.0
GPD Global has advanced its auger pump technology with the introduction of the newly developed Precision Auger Pump. This pump was designed to offer a wide range of functionality in your process development by being compatible with a wide range of auger/cartridge assemblies.
Industry News | 2003-06-04 09:19:23.0
With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.
Parts & Supplies | Pick and Place/Feeders
SANYO stick feeder GSF-R01 SANYO 5000 Stick Feeder The operation rate of the machine is improved by the ability of stick feeder to operate continuously over an extended period. Unlike traditional stick feeders that rapidly vibrate u
Parts & Supplies | Pick and Place/Feeders
GSF-R09 UNIVERSAL Stick Feeder GSF-R09 UNIVERSAL Stick Feeder The operation rate of the machine is improved by the ability of stick feeder to operate continuously over an extended period. Unlike traditional stick feeders that rapidly vi
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | IPC J-STD-001 Specialist (CIS)
The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.
Training Courses | | | IPC J-STD-001 Specialist (CIS) Recert.
The Certified IPC J-STD-001 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC J-STD-001 Specialists.
Events Calendar | Wed Jun 22 00:00:00 EDT 2022 - Wed Jun 22 00:00:00 EDT 2022 | ,
Empire Chapter Webinar: LIVE Action Reflow Focused Process
Events Calendar | Thu Jan 10 00:00:00 EST 2019 - Thu Jan 10 00:00:00 EST 2019 | Manassas, Virginia USA
SMTA Capital Chapter: Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | bargain face-to-face, California USA | Engineering,Maintenance,Sales/Marketing,Technical Support
I.C.T Global Localization Recruitment | Join Our Team Today! We are actively seeking talented individuals from around the world to join our team. Take a look at the following positions available: 1. Senior SMT Engineer: 3 people 2. SMT Service E
Career Center | Raymond, USA | Engineering,Maintenance,Management,Production,Technical Support
Expert knowledge of circuit board manufacturing for the through-hole and Surface Mount Technology industry, international and national field work to manufacturers. Provided high value technical assistance and formal training to industry standards. Sp
Career Center | Forney, Texas USA | Engineering,Management,Production
A hands-on, highly talented and accomplished manager with extensive skills and expertise in scheduling, engineering and management within a manufacturing environment. Seeking a position as manager with a company that allows for career advancement thr
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/about-us/careers/product-and-process-engineer
Product and Process Engineer. Your job: As a Product and Process Engineer, you will be: Assisting in the pre- and post sales process by performing demonstrations of our equipment
GPD Global | https://www.gpd-global.com/co_website/news-events-pr-493.php
,” commented Sven Wedekin, Vice President/General Manager. We plan to continue placing an even greater emphasis on assisting customers with dispense development to overcome difficult process challenges
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