Industry News | 2003-04-28 07:17:28.0
The conference took place March 22-27 in Long Beach, Calif., in conjunction with IPC Printed Circuits Expo� 2003
PRO 1600 is a full forced air / nitrogen convection reflow oven that covers only 31" x 31" of floor space. It has been designed for reflow soldering of even the most challenging applications including, high thermal mass and lead free assemblies. PRO
Overview of PRO 1600 Forced Convection Reflow Oven in operation. Features include small footprint (31" x 31"), lead free reflow capable, and precise software process control.
Overview of PRO 1600 Forced Convection Reflow Oven in operation. Features include small footprint (31" x 31"), lead free reflow capable, and precise software process control.
PRO 1600-B is a benchtop full forced air convection reflow oven. It has been designed for reflow soldering of even the most challenging applications including, high thermal mass and lead free assemblies. PRO 1600-B is very flexible in terms of profil
PRO 1600-RS is specifically configured for reflow simulation and thermal stress testing applications. This includes Preconditioning of Nonhermetic Surface Mount Devices (SMD) per JESD22-A113F standard, Moisture Sensitivity Level (MSL) testing of semi
SMT pick and place machine for prototype to low volume PCB assembly. Features software guidance, programming via CAD data transfer, loose parts handling, and camera vision.
Demonstrates desoldering, solder paste printing, and installation of a fine pitch QFP 208 (30.6mm x 30.6mm) component using an ATCO model AT-GDP Placement & Rework Station.
The CAT90-SA pick and place systems are semi-automatic machines featuring software guidance and the latest high resolution vision technology. Systems are designed for placement of various SMT components such as capacitors, resistors, SOIC’s, fine-pit
Industry News | 2014-12-19 23:52:27.0
ADLINK Technology today announced the release of its latest workstation grade PICMG 1.3 System Host Board, the NuPRO-E72, supporting 4th generation Intel® Xeon® E3-1200 v3, Core i3, Pentium and Celeron processors in a LGA1150 package with DDR3 1600 memory up to 16GB with ECC support.