Used SMT Equipment | Pick and Place/Feeders
Highlights of the SIPLACE CA: With the four SIPLACE SpeedStar heads for high-precision placements you can process up to 126,000 SMT components, 46,000 flip-chips, or 30,000 die-attach components per hour Component supplied from changeov
Used SMT Equipment | Screen Printers
Manncorp MC 1300 Semi Automatic Stencil Printer For Sale See attached pictures Missing the alignment cameras so being sold as is - Make resonable offer Buyer is responsible for packaging and shipping charges from our Boston, MA location W
Used SMT Equipment | Adhesive Dispensers
Camalot Dispenser 635 Pump Head Assembly Includes Touch Probe and Cables as Shown in attached picture Please inquire about hard to find Camalot Pumps, Parts, and PC Board Cards Buyer is responsible for all shipping charges. We can set up packagi
Used SMT Equipment | In-Circuit Testers
Agilent HP 3070 In-Circuit Tester For Sale Just came offline in Good Running Condition Please see attached pictures Buyer is responsible for all shipping charges. We can help set up skidding, packaging, crating, and shipping to countries over
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
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Parts & Supplies | Pick and Place/Feeders
N610100486AA Dual Conveyor Station(Trannsport Unit):NPM N610104465AA Attachment(LNB/HUB Dual Conveyor):NPM N610074920AA Tray Feeder Main Body :NPM N610069932AA Tray Feeder Lift Section:NPM N610069934AA Tray Feeder Drawing-out Section:NPM N610085
Technical Library | 2019-05-21 17:34:08.0
Flip chip components have been gaining popularity in the electronics industry since their introduction in the 1960s. Advances in attach methods and adhesives, as well as the drive for smaller and faster electronic devices made the technology take off. The basic premise of the flip chip is that the chip (semiconductor device) is mounted flipped from the traditional position. The traditional method of mounting a die is to mount it on a lead frame with the circuit and bond pads face up. The bond pads then receive a bond wire which then connects to the proper lead on the lead frame. Flip chips are mounted face down onto a substrate using small bumps on the bond pads to make direct electrical connection to their respective pads on the substrate. Stay tuned for more information on attachment techniques next month. This article will focus on how to rework flip chips.
Used SMT Equipment | Board Cleaners
Hello and thank you for your interest in our Westek Orbital Rotary PC Board Cleaner For Sale. See attached pictures and information below. Manufactured by Westek - Westkleen Serial Number: 109206-220-08 Model Number: 90001-230 Type: Orbi - The
Used SMT Equipment | Soldering - Wave
Very nice Electrovert Vectra Wave Solder Machine For Sale! See attached pictures and information below. Speedline Technologies Model Number: Vectra Type: Wave Solder Year: 06/1999 Foam Fluxer Pre-Heat 480 Volt - 3 Phase The machine is in g
Used SMT Equipment | THT Equipment
Very Nice Universal Instruments VCD Axial Sequencer For Sale The machine is in Good Running Condition See attached pictures and information below Equipment Information Universal Instruments Serial Number: 10058867 Model Number: 6241F 120
