Industry Directory | Manufacturer / Other
BGA Reballing Services - PBGA, TBGA, CBGA, and CSP reballing services as low as 0.02 cents/individual solder ball attachment. We provide solder column attachment, & tinning, by means of Hot Solder Dipping, for Electrical Components.
Microwave Plasma System for assembly cleaning prior to wirebond, attach, encapsulation, and underfill.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
New Equipment | Rework & Repair Equipment
Custom made reballing fixtures designed for your specific component. Allows for high yield reballing of multiple parts at one time. Use for ball attach to BGA components and for solder bumping of LGA's and QFN's. Simply send us the data sheet and
Electronics Forum | Wed Aug 16 16:43:47 EDT 2000 | Steve Thomas
O.K., I give up. I am through trying to solder thermocouples on to 20 mil pitch QFPs. Whether it's my lousy technique (fairly likely), the wrong solder (Kester calls it thermocouple solder, and who am I to argue...it's a Sn10Pb88Ag2 alloy) or just
Electronics Forum | Wed Aug 16 22:21:23 EDT 2000 | Dave F
Steve: Two things: 1 Chrys "The Thermo Princess" Shea wrote a great thread on attaching thermocouples that's in the SMTnet archives 2 Dymax (and probably others) makes a uV cureable thermal adhesive that's not a ugly to use as soldering thermal coup
Used SMT Equipment | General Purpose Test & Measurement
System has 6 probe heads 4 upper probe heads 2 lower probes heads Currently configured for analog testing Has SMEMA connections for loader/unloader to be attached Can be used for left to right or right to left load configuration All maintenance
Used SMT Equipment | Pick and Place/Feeders
Product number: KD - 2077 Products in detail Features: High speed dispensing/adapt to more stablerange Equal to KE series ofhigh-performance/operability Attaches great importance to thecompatibility and environment design Parameters: Substrate
Industry News | 2009-02-02 18:48:47.0
Henkel today announced the appointment of Mr. Luc Godefroid as the company's Global Sales Director for its Semiconductor Group. A key member of Henkel's electronics sales team since 2001, Godefroid's new role sees him building on his previous success and directing the global sales efforts of Henkel's worldwide team and expanded product portfolio.
Industry News | 2011-09-12 12:04:25.0
GPD Global will showcase its Positive Cavity Displacement (PCD) 'H' Series high-resolution pumps in Booth #439 at the upcoming IMAPS 44th International Symposium on Microelectronics
Parts & Supplies | SMT Equipment
Yamaha KHN-M7210-03X CCD CAMERA KHY-M71B0-L0 VISION ATTACHMENT L KHN-M7210-01 CCD CAMERA KHY-M7211-00 LENS FID. KHN-M7600-00 FIDUCIAL LIGHT ASSY Pls kindly contact with us at any time, if you are insterest more info about products. Website
Juki FX1R stop sensor L825E1210A0 Specs: JUKI FX1R stop sensor L825E1210A0: E94677250A0 OUT SENSOR CABLE ASM E94637250A0 IN SENSOR CABLE ASM E94667250A0 C.OUT SENSOR CABLE ASM E94657250A0 STOP SENSOR CABLE ASM E95517250A0 F FEED
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2023-12-15 03:06:24.0
The first process in the SMT industry is solder paste printing. After the solder paste printing is completed, electronic components are attached to PCB pads through a SMT machine, and then reflow soldered. A preliminary PCB board is roughly processed. SMT is a combination of multiple devices, and such a line is called an SMT production line. Our common PCBA is processed through this process. In SMT technology, each process is very important, and poor quality can be caused by different process defects. Today, we are discussing the causes and countermeasures of SMT printing collapse.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Wed Jun 22 00:00:00 EDT 2022 - Wed Jun 22 00:00:00 EDT 2022 | ,
Empire Chapter Webinar: LIVE Action Reflow Focused Process
Events Calendar | Tue Mar 30 00:00:00 EDT 2021 - Tue Mar 30 00:00:00 EDT 2021 | ,
Wisconsin Chapter Webinar: PCB Assembly – Labeling and Marking Technology and Materials
Career Center | South Plainfield, New Jersey USA | Management,Research and Development,Sales/Marketing
Alpha Assembly Solutions, a MacDermid Performance Solutions Business and a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seek
Career Center | Somerset, New Jersey USA | Engineering,Management,Sales/Marketing
Alpha Assembly Solutions, a MacDermid Performance Solutions Business and a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seek
Career Center | SanPedro, Philippines | Maintenance,Production
Set-up Equipment machine and ensure its proper operation for costumer satisfaction. Carry out all Proactive Maintenance (PM) tasks such as predictive maintenance, preventative maintenance, failure finding maintenance and calibration maintenan
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| Surface Mount Technology ❙ Reflow Oven | Surface Mount Technology Reflow oven , SMT reflow oven, reflow sodlering is the most widely used method of attaching surface mount components to printed circuit boards (PCBs
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_library-expert-2016-09-released_topic1934.xml
Marking:Fixed and issue with Polarity Marking attaching to the centroid markerLibrary Editor:Fixed an issue with BGA’s saving Local Fiducial data in FPX file3D
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