Electronics Forum | Tue Jun 07 20:17:09 EDT 2022 | SMTA-64387182
Understood, Thanks, Joe
Electronics Forum | Thu Jun 02 14:23:36 EDT 2022 | SMTA-64387182
We are designing a new PCB that will include a 0.4 mm WLCSP IC package. The OEM’s application-note for this package states ENIG; Au
Electronics Forum | Fri Jun 03 15:19:32 EDT 2022 | dwl
I don't recall thicknesses off the top of my head but brittleness becomes an issue more for gold plating then ENIG. .125 um should be fine. also, gold ain't cheap so its unlikely your PCB fab will get anywhere near the max tolerance. On the other e
Electronics Forum | Fri May 28 17:44:51 EDT 1999 | Glenn Robertson
| I discovered that we have some gold plated (30 mico in.) through hole connectors which were Paste In Hole soldered (60 sec at reflow) on a HASL PCB. Do we have an embrittlement reliability issue? The calculated volume % of gold in the joints is abo
Electronics Forum | Sun Apr 15 23:35:14 EDT 2007 | Sam
few more questions: Is there any standard saying that the dull surface is accepted if solder Au plated leads? Understand that more than 3% Au in the solder connection leads to unacceptable embrittlement of the connection. How about any standard relat
Electronics Forum | Sat Nov 01 11:08:47 EDT 2008 | vladig
In addition to what Dave has said, you shouldn't worry much about having too much (too thick) of Au, as it's a self-limiting process. So Gold embrittlement isn't an issue. Regards, Vlad
Electronics Forum | Mon Feb 19 18:57:49 EST 2001 | davef
Expanding on the limit of the portion of gold acceptable in a solder connection [mentioned in an earlier post]: The embrittlement culprit, AuSn4, is 29 weight percent gold. So even if one had 100% tin as the solder alloy and 10% gold were dissolved
Electronics Forum | Mon Jun 12 07:42:56 EDT 2006 | brian.perry@suntroncorp.com
We are placing a gold plated device (LCC) to a NiAu PCB using a SnPb No-clean solder. We're noticing quite a bit of difficulty with reliable joints (intermittent connectivity) and if we have to rework a particular device, adjacent devices of this sa
Electronics Forum | Wed May 05 15:31:14 EDT 2021 | edhare
0.5 to 1 micron is typically too thick and can result in gold embrittlement of the solder joint. Typical IG thickness is 0.18 microns. see https://www.semlab.com/papers/gold-embrittlement-of-solder-joints/ Ed Hare
Electronics Forum | Fri Dec 26 00:30:36 EST 2003 | Indy
hi, I wondering if anyone have any information on intermetallic growth in 80Au20Sn solder alloy. I have read that it has high reliability. Which bring an important question to my mind. What about Gold embrittlement ? Bye Indy
