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Used SMT Equipment | Adhesive Dispensers
Asymtek Dispensemate 555 Dispensing System The DispenseMate 550 Series brings new dispensing power to a compact package. In a benchtop format, many of today's advanced automated dispensing features are available. It is ideal for batch processing or
http://www.gpd-global.com 01005 dispensing is a challenge for you? Watch this video for Solder Paste Dispensing Micro Volume Dots 150µm with 062 Auger, 31G Precision Needle, Micro Volumes for 01005 components - excellent results. Micro dot. More in
The TS5000DMP positive displacement valve availoable from Keltech Ltd offers advances in the controlled application of pastes, adhesives and assembly fluids. More accurate than standard time/pressure valves, the TS5000DMP uses a disposable fluid fee
The TS5000DMP positive displacement valve availoable from Keltech Ltd offers advances in the controlled application of pastes, adhesives and assembly fluids. More accurate than standard time/pressure valves, the TS5000DMP uses a disposable fluid fee
Epoxy 4089 is a single part, epoxy adhesive used for bonding SMT components to a PWB prior to double sided reflow or wave solder assembly. Epoxy 4089 has been formulated for use in all types of high speed dispensing equipment including air pressure,
Stinger is a low volume dispense module attached to the camera carriage of a standard DEK printer (as an optional extra). It is not designed to replace a regular dispenser but to provide dual functionality to the print platform for customers who requ
Technical Library | 2022-10-31 17:25:37.0
Mixed formulation solder alloys refer to specific combinations of Sn-37Pb and SAC305 (96.5Sn–3.0Ag–0.5Cu). They present a solution for the interim period before Pb-free electronic assemblies are universally accepted. In this work, the surfaces of mixed formulation solder alloys have been studied by in situ and real-time Auger electron spectroscopy as a function of temperature as the alloys are raised above the melting point. With increasing temperature, there is a growing fraction of low-level, bulk contaminants that segregate to the alloy surfaces. In particular, the amount of surface C is nearly _50–60 at. % C at the melting point. The segregating impurities inhibit solderability by providing a blocking layer to reaction between the alloy and substrate. A similar phenomenon has been observed over a wide range of (SAC and non-SAC) alloys synthesized by a variety of techniques. That solder alloy surfaces at melting have a radically different composition from the bulk uncovers a key variable that helps to explain the wide variability in contact angles reported in previous studies of wetting and adhesion. VC 2011 American Vacuum Society. [DOI: 10.1116/1.3584821]
Used SMT Equipment | Soldering Equipment/Fluxes
Precision Batch Semiconductor Dispenser by Nordson Asymtek, as new. Nordson Asymtek DS-S-820 product information. Motion System Type: Brushless DC servo motors, closedloop with precision encoder feedback Encoder resolution: 10 microns X-Y
Used SMT Equipment | Semiconductor & Solar
Precision Batch Semiconductor Dispenser by Nordson Asymtek, as new. Nordson Asymtek DS-S-820 product information. Motion System Type: Brushless DC servo motors, closedloop with precision encoder feedback Encoder resolution: 10 microns X-Y ac
Industry News | 2019-03-18 08:19:56.0
Techcon today announced plans to exhibit at productronica China, scheduled to take place March 20-22, 2019 at the Shanghai New International Expo Centre. The company will showcase its TSR2000 Smart Dispensing Robots, TS5000DMP-DCX Valve and TS570R Smart Auger Valve Controller in Hall E2, Booth #2508.
A Manufacturer of High Quality, Precision, Automated Fluid Dispensing and Conformal Coating Systems, SMT Cover Tape Peel Tester and Lead Forming machines for through-hole component preparation.
611 Hollingsworth Street
Grand Junction, CO USA
Phone: (970) 245-0408
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