Industry News | 2014-02-17 20:35:12.0
Techcon Systems will showcase the TS9200 Series Jet Tech valve in Booth #2225 at the IPC APEX Expo, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.
Industry News | 2014-04-15 07:48:16.0
Techcon Systems will exhibit in Booth #B-1E25 at NEPCON China 2014, scheduled to take place April 23-25, 2014 at the Shanghai World EXPO Exhibition & Convention Center.
Industry News | 2014-07-28 21:23:25.0
Techcon Systems, will exhibit in Booth #A-1K25 at NEPCON South China, scheduled to take place August 26-28, 2014 at the Shenzhen Convention & Exhibition Center.
Industry News | 2016-03-24 21:18:44.0
Techcon Systems will exhibit in Booth #B-1E52 at NEPCON China, scheduled to take place April 26-28, 2016 at the Shanghai World EXPO Exhibition & Convention Center. Company representatives will debut the new TS9300HM Hot Melt Jet Valve at the show and showcase its lineup of industry-leading valves.
Industry News | 2011-10-03 16:39:42.0
Techcon Systems, a product group of OK International will showcase its precision valves in its distributor, DGMarketing Services Inc.’s Booth #431 at the upcoming SMTA International Conference & Exhibition
Industry News | 2012-06-02 11:29:30.0
Techcon Systems, announces that its new Quick Reference Valve Spare Part Guide is now available. The guide includes part numbers, product descriptions, special instructions and diagrams for Techcon Systems’ valves.
Industry News | 2014-09-16 11:29:42.0
Engineered Material Systems will introduce its new 561-147 Snap Cure Conductive Adhesive in Hall 1, Booth E19 at EU PVSEC, scheduled to take place Sept. 23-25, 2014 at the RAI Convention & Exhibition Centre in Amsterdam.
Industry News | 2017-08-17 10:22:27.0
Engineered Material Systems announces the introduction of its new CA-150 Series Snap Cure, Low Cost Conductive Adhesive for stringing and shingling crystalline silicon and heterojunction solar modules. The CA-150 Series will be shown for the first time at the EU PVSEC Photovoltaic Exhibition, scheduled to take place September 25-28, 2017 in Amsterdam, The Netherlands.
Industry News | 2018-05-08 19:23:28.0
Engineered Material Systems announces plans to exhibit at the SNEC PV Power Expo, scheduled to take place May 28-30, 2018 in Shanghai, China. The company will showcase its CA-150 Series snap cure, low-cost conductive adhesive for stringing and shingling crystalline silicon and heterojunction solar modules in Hall W3, Booth 806.
Industry News | 2015-08-23 14:25:07.0
Engineered Material Systems, will showcase its 561-403 Conductive Adhesive at the EU PVSEC show, scheduled to take place September 15-17, 2015 in Hamburg, Germany. EMS 561-403 is a snap cure, low cost conductive adhesive designed for Heterojunction (HIT) and Multi Bus Bar silicon solar modules.
A Manufacturer of High Quality, Precision, Automated Fluid Dispensing and Conformal Coating Systems, SMT Cover Tape Peel Tester and Lead Forming machines for through-hole component preparation.
611 Hollingsworth Street
Grand Junction, CO USA
Phone: (970) 245-0408
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