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Engineered Material Systems to Showcase Adhesives for Stringing and Shingling Next Generation Solar Modules at Intersolar/EU PVSEC

Industry News | 2016-05-09 21:08:21.0

Engineered Material Systems will exhibit its new 561-400 series Low-Cost Snap Cure Conductive Adhesives at the Intersolar/EU PVSEC show, scheduled to take place June 23-25, 2016 in Munich. The 561-400 series is designed for stringing and shingling crystalline silicon and heterojunction solar modules.

Engineered Conductive Materials, LLC

Engineered Material Systems to Showcase Adhesives for Stringing and Shingling Next-Generation Solar Modules at Intersolar North America

Industry News | 2016-07-07 14:54:56.0

Engineered Material Systems will exhibit its new 561-400 series Low-Cost Snap Cure Conductive Adhesives at Intersolar North America, scheduled to take place July 12-14 in San Francisco, CA. The 561-400 series is designed for stringing and shingling crystalline silicon and heterojunction solar modules.

EMS International Corporation

Engineered Material Systems to Showcase Conductive Adhesives for Next-Generation Solar Modules at the SNEC PV Power Expo

Industry News | 2019-05-13 17:45:44.0

Engineered Material Systems announces plans to exhibit at the SNEC PV Power Expo, scheduled to take place June 4-6, 2019 in Shanghai, China. The company will showcase its CA-150 Series snap cure, low cost conductive adhesive for stringing and shingling crystalline silicon and heterojunction solar modules in Hall W4, Booth 353.

Engineered Materials Systems, Inc.

Engineered Material Systems to Showcase Conductive Adhesives for Next-Generation Solar Modules at Intersolar Europe

Industry News | 2017-05-01 14:59:41.0

Engineered Material Systems announces plans to show its CA-150 Series Snap Cure, Low Cost Conductive Adhesive for stringing and shingling crystalline silicon and Heterojunction solar modules at Intersolar Europe. The new conductive adhesive will be displayed in Hall A2, booth 319 at Intersolar Europe, scheduled to take place May 31-June 2, 2017 in Munich, Germany.

Engineered Materials Systems, Inc.

Engineered Material Systems to Showcase CA-150 Series Conductive Adhesives for Next-Generation Solar Modules at the SNEC PV Power Expo

Industry News | 2017-03-14 10:58:12.0

Engineered Material Systems announces the introduction of its new CA-150 Series Snap Cure, Low Cost Conductive Adhesive for stringing and shingling crystalline silicon and Heterojunction solar modules. The new conductive adhesive will be displayed in Hall W3, booths 806/807 at the SNEC PV Power Expo, scheduled to take place April 19-21, 2017 in Shanghai, China.

Engineered Materials Systems, Inc.

CAMALOT MicroDot Dispensing System

Industry News | 2003-04-07 13:08:13.0

Cookson Electronics Equipment Announces Camalot XYFLEXPRO Microdot Dispensing Capabilities

Phoenix United Associates, Inc.

Stinger� Printer-adaptable Dispensing Technology

Industry News | 2009-04-19 23:40:32.0

Recently launched at the Apex exhibition in Las Vegas, Ovation Products' brand new and award-winning Stinger� adhesive dispenser is currently attracting attention industry-wide. Offering unmatched equipment utilization, Stinger enables dual function capability from a single screen printer.

Ovation Products

DEK launches Stinger; brand new low volume adhesive dispenser

Industry News | 2009-04-27 18:00:47.0

DEK has launched its brand new Stinger* technology, an integrated low volume adhesive dispense module enabling dual function capability from a single screen printing platform. Ideal for customers working with mixed technology boards for example, Stinger is an easy-to-use, flexible system featuring innovative patented technology to eliminate unnecessary stoppages and raise productivity.

ASM Assembly Systems (DEK)

Data Sheet Now Available for Techcon’s TS7000 IMP Rotary Valve

Industry News | 2010-07-06 11:20:59.0

Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, announces that it has released a data sheet for its TS7000 Series Interchangeable Material Path (IMP) Rotary Valve. The TS7000 is the latest addition to Techcon’s rotary micro-valve family.

Techcon Systems

Techcon Systems to Exhibit Dispensing Solutions at the SMTA Houston Expo & Tech Forum

Industry News | 2011-02-21 17:35:53.0

Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, will showcase its precision fluid dispensing solutions at the upcoming SMTA Houston Expo & Tech Forum, scheduled to take place Thursday, March 3, 2011 at the Stafford Centre in Stafford, TX.

Techcon Systems


auger searches for Companies, Equipment, Machines, Suppliers & Information

GPD Global
GPD Global

A Manufacturer of High Quality, Precision, Automated Fluid Dispensing and Conformal Coating Systems, SMT Cover Tape Peel Tester and Lead Forming machines for through-hole component preparation.

Manufacturer

611 Hollingsworth Street
Grand Junction, CO USA

Phone: (970) 245-0408