Industry News | 2010-04-23 18:53:17.0
Indium Corporation announces the signing of a joint marketing and technical support agreement for high-temperature Pb-free electronics assembly materials patented and manufactured by Ormet Circuits, Inc.
Industry News | 2013-01-04 08:55:03.0
Finetech will showcase the sub-micron placement accuracy FINEPLACER® Lambda bonder
Industry News | 2011-08-30 20:10:58.0
At this year’s Productronica 2011, booth #A4-281, Finetech will present selected highlights from the acclaimed FINEPLACER® bonder range.
Electronics Forum | Wed Sep 29 14:46:59 EDT 2004 | Bryan Smith, Micralyne
I am curious to hear feedback on whether companies that could benefit from a AuSn solder plating process would prefer to bring it inhouse (ie. License) or outsource the plating. I look forward to your comments. Bryan Smith Micralyne www.goldtinsold
Electronics Forum | Fri Oct 01 18:12:02 EDT 2004 | Bryan Smith
Hi Greg, You can find details on our AuSn solder plating at http://www.goldtinsolder.com. Call me at 780-431-4412 if you have questions. Take care, Bryan
Electronics Forum | Wed Sep 29 16:01:25 EDT 2004 | davef
Sure, if it is competitive with alternatives. Is it?
Electronics Forum | Sat Jan 30 21:04:32 EST 1999 | Sidharth
Hi all, i'm researching information on fluxless solder bumping of flip-chip by either : 1. electroplating AuSn bumps 2. electroless Ni on Al pads in an autocatalysis process. could anyone point me in the direction of more information ? partic
Electronics Forum | Fri Oct 01 18:07:46 EDT 2004 | Bryan Smith
Hello Dave, Yes, this is a patented commercial process in our MEMS Foundry and we are already working with several customers. I posted my question because we only recently have started widely promoting our AuSn plating services and we're still grasp
Electronics Forum | Thu Oct 05 15:58:16 EDT 2006 | RusH
Mario, Thanks for your response. We are building a leaded assembly with hot air leveled Sn/Pb pads on the PCB. In one case the component is a 7.5X5.2X1.8 wire wound ferrite inductor with Au/Sn leads. The second component is an 0808 Tantalum cap,
Electronics Forum | Fri Dec 26 00:30:36 EST 2003 | Indy
hi, I wondering if anyone have any information on intermetallic growth in 80Au20Sn solder alloy. I have read that it has high reliability. Which bring an important question to my mind. What about Gold embrittlement ? Bye Indy
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