Electronics Forum | Thu Nov 01 17:40:52 EST 2001 | davef
Listen to Wolfgang. Your dull solder connection is a process indicator. Some 63Sn / Au solder connections look grainy, depending on how your process them and the materials involved. Gold dissolving in tin forms an intermetallic compound [AuSn4] th
Electronics Forum | Sat Nov 21 12:28:00 EST 2009 | flipit
There is evidence of lead being used in soldering 5000 years ago in Mesopotamia. Not a big issue for most people doing SMT but the poster should also understand why percent metal is adjusted for different solder paste alloys. You print by volume b
Electronics Forum | Tue Sep 09 20:32:10 EDT 2003 | davef
The maximum ratio of gold weight to solder alloy weight can be calculated, to help prevent a problem from excessive gold-tin intermetallic compound (i.e., AuSn4). For the equation and its derivation, please refer to "The Use of Capillary Action Measu
Electronics Forum | Thu Sep 17 10:45:27 EDT 1998 | Justin Medernach
| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material
Electronics Forum | Tue Sep 22 10:52:31 EDT 1998 | Wayne Bracy
| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material
Electronics Forum | Fri Sep 18 08:49:12 EDT 1998 | Earl Moon
| | We have problems with voids when we solder lids to | | ceramic flatpackages. | | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | | The solder is attached to the lid (preform) and the solder
Electronics Forum | Wed Oct 24 18:08:02 EDT 2001 | davef
1- DF1: WOW!!! How do people get these cool toys? CB: I am with the University at Buffalo Electronic Packaging Lab. http://www.packaging.buffalo.edu We have pretty much everything that is sold on the market as well as Laser inspection technologies we
Electronics Forum | Tue Mar 21 20:25:30 EST 2000 | Dave F
John: What�s the matter? Free gold � good thing for you, bad thing for your supplier. :^) Pre-tinning of gold plated leads is important to: � Prevent gold embrittlement of the solder joint � Determine if the leads are solderable prior to assembly (
Electronics Forum | Fri Sep 17 15:01:05 EDT 1999 | Dave F
| | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re
Electronics Forum | Sat Sep 18 04:42:52 EDT 1999 | Brian
Dave, I'll respond by paragraph: | | | Brian: | | I like Ag2 also. I prefer it over both 63/37 and 60/40, if the price is not a factor. Yes, gold rips through eutectic and near-eutectic solders like habanero slathered shiitake burritos through
