Electronics Forum | Wed Apr 05 11:55:28 EDT 2006 | Cristina Oanca
I am working on a Substrate attach process. The package is gold plated, the preform is AuSn and the backing on the substrate is PdAg. I am using a Sikama reflow furnace. The profile has a 50 sec dwell time. I am over 280 degees C for a little over 1
Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish SMTnet Express December 13, 2012, Subscribers: 26067, Members: Companies: 9068, Users: 34058 Influence of Pd Thickness on Micro Void Formation of Solder
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