High Speed, Large Area (12in x 6in.) Ball bonder with Continuous Bonding Technology.
Industry News | 2013-11-11 08:27:31.0
Juki Automation Systems (JAS) Inc. awarded MAN-TechSystems Best Screen Printer Sales 2013 at the recent awards banquet held during the Juki Americas National Sales meeting.
A multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm. This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bon
Industry News | 2012-02-07 16:16:09.0
Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges. The multi-application FINEPLACER® Pico MA bonder with 5 micron placement accuracy is valued at $100,000.
The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to
Industry News | 2012-08-29 10:27:05.0
Pennsylvania State University was selected in a university donation drawing for a FINEPLACER® Pico MA bonder on August 15, 2012.
Industry News | 2013-11-20 16:52:27.0
GKG Asia Pte Ltd announces that it participated in the recent productronica exhibition that took place November 12-15, 2013 in Munich, Germany and reports that the show was a complete success.
Used SMT Equipment | SMT Equipment
ASM Bonding machine for sales : Wedge Bonder AB530 Dispenser DS500 Die Attach AD896 Few sets for each unit Please e-mail to customerst@163.com
Industry Directory | Manufacturer
Pioneer develops custom turnkey die-cutting systems consisting of both dies and presses for a variety of industries and applications.
