Industry News | 2009-11-24 22:09:36.0
Screen printing and mass imaging world leader DEK chose Productronica earlier this month to launch Sentinel, a breakthrough productivity-enhancing solution that lowers the cost of achieving more good boards from the stencil printing process.
Industry News | 2009-12-03 18:24:04.0
DEK has announced the launch of its new Over Top Snuggers (OTS) substrate clamping technology. Securing printed circuit boards firmly in place ready for processing, the flexible technology is designed to ensure high quality printing for enhanced end-of-line yield.
Industry News | 2010-05-11 14:53:59.0
DEK is preparing to take a whole host of innovative technologies to this year’s SMT/Hybrid/Packaging exhibition, being held in Nuremberg from 8th – 10th June 2010. Stand 7-305 will showcase DEK’s productivity-boosting solutions, from powerful print platforms through to next-generation stencil technologies and Process Improvement Products.
Industry News | 2020-09-01 12:27:21.0
Seika Machinery, Inc. is pleased to announce its participation in the SMTA International Virtual Conference & Exposition. The Live Virtual Expo is scheduled to take place Sept. 28-30, 2020. Seika will highlight the Sawa SC-BM500E Automatic Ultrasonic Metal Stencil Cleaner, Sayaka SAM-CT34NJW Twin Table PCB Router with online camera for programming, Tsuchiyama n=1 Checker FAI and Kyowa PCAS Software Series for PCB Measurement.
Industry News | 2021-02-12 16:00:16.0
Seika Machinery, Inc. is pleased to announce its participation in the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. Seika will highlight the Sawa SC-BM500E Automatic Ultrasonic Metal Stencil Cleaner, Sayaka SAM-CT34NJW Twin Table PCB Router with online camera for programming, Tsuchiyama n=1 Checker FAI and Kyowa PCAS Software Series for PCB Measurement.
Industry News | 2019-01-05 16:26:04.0
SHENMAO America is pleased to announce that it will exhibit in Booth #1304 at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31, 2019 at the San Diego Convention Center. The company will showcase its new PF606-F13 solder wire and PQ10 series low temperature solder paste.
Industry News | 2011-05-19 22:07:36.0
On September 29, 2011, Finetech will hold the 8th International User Meeting “Micro Assembly” in Berlin. This series of events aims at prospects, users and experts alike and has become a fixed point of the annual industry calendar, attracting a steadily growing number of visitors.
Industry News | 2012-02-07 16:16:09.0
Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges. The multi-application FINEPLACER® Pico MA bonder with 5 micron placement accuracy is valued at $100,000.
Industry News | 2013-01-04 08:55:03.0
Finetech will showcase the sub-micron placement accuracy FINEPLACER® Lambda bonder
Industry News | 2020-08-07 05:21:03.0
Test Research, Inc. (TRI) is pleased to announce that it will be featuring Test and Inspection solutions for Semiconductor and Advanced Packaging Production Lines at SEMICON Taiwan 2020. Visit TRI at booth # J2534 to discover High-Precision Inspection for the Semiconductor Industry at Taipei Nangang Exhibition Center Hall 1.
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