Semi-Automatic Screen Printer The M2H semi-automatic screen printer has been designed for printing of ceramic hybrids in applications with small to medium size production volumes, R&D and laboratory as well as prototyping purposes. But also a lar
Automatic Offline Screen Printer The XH STS stencil and screen printing system was specially developed for printing substrates in thick film applications. The flexible system can be used in a wide number of areas within the hybrid, SMT and solar fi
Benchtop semi-automatic (16”x 16” print area) for lab/prototype or general production Pneumatic shuttle plate on v-wheels for easy substrate loading/unloading Pneumatic pop-up cylinders with adjustable separation control. Great for low vi
Industry News | 2009-01-16 17:14:22.0
FINETECH will showcase chip-to-wafer bonding with the sub-micron placement accuracy FINEPLACER� Femto at the upcoming Photonics West exhibition (booth 519) in San Jose, CA, January 27-29, 2009
Industry News | 2018-10-09 18:44:45.0
Nordson DAGE announces the launch of Quadra® W8, a versatile lab-based solution for wafer-level inspection offering industry-leading magnification and image quality. Integrated dual port EFEM provides complete wafer protection by removing any manual wafer handling so operators can inspect wafer level quality directly from the FOUP.
Industry News | 2018-10-09 18:44:51.0
Nordson DAGE announces the launch of Quadra® W8, a versatile lab-based solution for wafer-level inspection offering industry-leading magnification and image quality. Integrated dual port EFEM provides complete wafer protection by removing any manual wafer handling so operators can inspect wafer level quality directly from the FOUP.
A multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm. This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bon
Industry News | 2009-10-02 18:24:04.0
Everett Charles Technologies announces that Jim Brandes, Product Manager, will hold a presentation titled “Kelvin Contactors for Wafer-Scale Test” at the upcoming International Wafer-Level Packaging Conference and Tabletop Exhibition, scheduled to take place October 27-30, 2009 at the Santa Clara Marriott in Santa Clara, CA. The presentation will be held during Session 16, “WLP Reliability and Test,” which is scheduled to take place Friday, October 30, 2009 from 3-5 p.m.
Industry News | 2021-07-15 03:55:39.0
The latest fixtureless technology available for production and validation testing the most challenging Probe Cards
Complete TTC Solutions for Electronics Applications Industry leaders within electronics and semiconductor manufacturing need to enable lean manufacturing, assure quality, and optimize efficient use of resources. Microscan products help these compan
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