Industry Directory | Consultant / Service Provider
Specialists in Engineering, Design, System Level Product Development, Prototyping and Printed Circuit Boards SunMan provides Electrical Engineering Services from Design to Manufacturing
Industry Directory | Manufacturer
Global Designer & manufacturer of advanced electronic components, modules, systems & contract assemb
Real Time Process Control with FPC: Fluid Pressure Control (Patented) Runs your pump at optimal levels at all times instead of starving or drowning it with inadequate or excessive fluid flow from the reservoir Real Time Process Control (FPC) is a b
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Electronics Forum | Thu Jun 11 14:09:43 EDT 2020 | emeto
Awesome machine! For grabbing the image and addressing camera quick you should get a camera with card and eventually application software. These are industrial and more expensive. 1394 interface is very common interface for the industry. Once you hav
Electronics Forum | Thu Aug 19 13:29:43 EDT 2004 | davef
Things we�d like to have in a reflow oven are: * Small variation in temperature [+-2*C] from rail-to-rail. * Consistent temperature over time [3+ sigma]. * Thermal inertia / fast recovery to be able to respond to the effects of high mass boards. * Ra
Used SMT Equipment | In-Circuit Testers
Aeroflex IFR ATC-1400A Aeroflex/IFR ATC-1400A Transponder/ DME Bench Test Set The ATC-1400A is a microprocessor-based test set designed to accomplish complete testing of modern ATC Transponder and DME equipment. When interfaced with the T-140
Used SMT Equipment | In-Circuit Testers
The ATC-1400A is a microprocessor-based test set designed to accomplish complete testing of modern ATC Transponder and DME equipment. When interfaced with the T-1401, S-1403DL or SI-1404 accessory units, the ATC-1400A becomes a comprehensive test s
Industry News | 2016-05-10 14:16:16.0
GPD Global offers individual pumps for integration into your existing platform – the Jetting NCM5000 Pump is one of them. The Jetting NCM5000 Pump simplifies jetting to its basic elements: hammer, pin, and nozzle. Only the pin and nozzle are wetted parts. This means easy set-up, cleaning, and upkeep.
Industry News | 2003-03-27 08:15:33.0
Modular Embedded Circuit Board from parvus Enables Local Device Fingerprint Biometrics
Technical Library | 2016-05-12 16:29:40.0
Advances in miniaturized electronic devices have led to the evolution of microvias in high density interconnect (HDI) circuit boards from single-level to stacked structures that intersect multiple HDI layers. Stacked microvias are usually filled with electroplated copper. Challenges for fabricating reliable microvias include creating strong interface between the base of the microvia and the target pad, and generating no voids in the electrodeposited copper structures. Interface delamination is the most common microvia failure due to inferior quality of electroless copper, while microvia fatigue life can be reduced by over 90% as a result of large voids, according to the authors’ finite element analysis and fatigue life prediction. This paper addresses the influence of voids on reliability of microvias, as well as the interface delamination issue.
Technical Library | 2015-01-28 17:39:34.0
Stacking heterogeneous semiconductor die (memory and logic) within the same package outline can be considered for less complex applications but combining the memory and processor functions in a single package has compromised test efficiency and overall package assembly yield. Separation and packaging the semiconductor functions into sections, on the other hand, has proved to be more efficient and, even though two interposers are required, more economical. The separated logic and memory sections are configured with the same uniform outline for vertical stacking (package-on-package). The most common configuration places the logic section as the base with second tier memory section soldered to a mating contact pattern. This paper addresses the primary technological challenges for reducing contact pitch and package-on-package interface technology.
Real Time Process Control with FPC: Fluid Pressure Control (Patented) Runs your pump at optimal levels at all times instead of starving or drowning it with inadequate or excessive fluid flow from the reservoir Real Time Process Control (FPC) is a b
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Events Calendar | Tue Dec 04 00:00:00 EST 2018 - Tue Dec 04 00:00:00 EST 2018 | ,
Qualification and Reliability of Microvias
Career Center | Oakville, Ontario Canada | Engineering,Management,Production,Quality Control,Research and Development
Individuals who excel in this position enjoy working on the hardware-software boundary, are driven by complex problem solving in a fast paced environment. Candidate should be familiar with most of the electronic technologies and be able to work wit
Career Center | Clinton, Connecticut USA | Quality Control
Connecticut based contract manufacturer of printed circuit board assemblies seeking an experienced Quality Control Inspector. This is a full time position at a company the offers health benefits, 401K working in a clean, pleasant and congenial atmosp
Career Center | Fayetteville, Arkansas USA | Engineering,Production
I enjoyed working in Electronics Manufacturing while in college (BSEE) and would like to pursue an engineering job in a related field.
Career Center | , | 2013-01-25 05:38:51.0
PLC programmer , PIC micro controller . have a basic knowledge of C C++ & assembly language.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/thermal-compounds?con=t&page=26
Thermal Interface Materials (TIM) | Thermal Compound | Nordson EFD Nordson EFD Corporate | Global Directory | Languages Division Only All of Nordson Home Products Accessories
ORION Industries | http://orionindustries.com/q-pad.php
0.006" thick, they are an optimal thickness for interface between transistors & heat sinks, heat sinks and chassis, or brackets and chassis