Electronics Forum | Wed May 24 19:46:32 EDT 2006 | JohnM
So, it looks like the backward compatible of BGA statement is not guarantee for solder joint reliability. It doesn�t matter what temperature and what melting sequence we have in order to avoid the solder void issue. Is Pb diffused homogeneously thr
Electronics Forum | Fri Oct 27 07:39:54 EDT 2006 | jdumont
Just wondering if anyone has seen this problem before. We are using a 456 ball FPGA and during installation on our BGA rework machine the corners curl up causing opens there. The part was profiled with our KIC and matches the paste MFG spec. Is this
Electronics Forum | Tue May 05 21:17:46 EDT 2015 | warwolf
So, im tasked to outline that the centre of a 28cm x 20cm PCB has the most susceptible stresses in the centre, my reson is to avoid putting the BGA there. I had a really good article outlining this but I carnt find it. can anyone help?
Electronics Forum | Mon Jun 19 05:11:08 EDT 2006 | WEEEsted
Hi, In our setup what we usually avoid is to use RoHS BGA on Pb process. But we use sometimes Pb transistor(4~6pins) on RoHS process, no BGA yet have been reported. Its really difficult to say about reability unless you start running some functional
Electronics Forum | Mon Jan 29 09:50:37 EST 2007 | rgduval
I'm about to begin a job for a customer placing a couple of lead free BGA's/FPGA's on an assembly that doesn't need to be RoHS compatible. So...my question is...should I process this assembly with lead-free solder paste, to accomodate the lead-free
Electronics Forum | Wed Nov 07 17:11:14 EST 2001 | davef
1 CAN WAVE SOLDER AFFECT OR DAMAGE BGA? Sure. Since you are vague, assuming: * Partially assembled board was not stored to prevent moisture absorption. * BGA is in a plastic package. * Partially assembled board was stored long enough to exceed th
Electronics Forum | Fri Jun 10 12:51:54 EDT 2016 | ttheis
Our company is looking to upgrade from a dek249 semi-auto printer to an automatic inline printer since we're doing some fine pitch packages which are tricky to line up, and we'll soon be tackling bga's for our products. We're looking on the used mark
Electronics Forum | Thu Apr 26 16:52:53 EDT 2001 | fmonette
Robert, Someone already mentioned the popcorning phenomena. This would show up as a dome-shaped deformation underneath the component, due to internal delamination around the die area. However what you describe sounds like another moisture-related
Electronics Forum | Fri Jun 18 06:54:43 EDT 1999 | Paul McMichael
A user of one of our components exceeded the floor life of some plastic BGA components. They did do a pre-bake prior to SMT reflow but only 72 hrs at 40C and not the recommended 12 hours at 125C. I've recommended accoustic microscopy to look for popc
Electronics Forum | Fri Jun 18 13:30:01 EDT 1999 | John Thorup
| A user of one of our components exceeded the floor life of some plastic BGA components. They did do a pre-bake prior to SMT reflow but only 72 hrs at 40C and not the recommended 12 hours at 125C. I've recommended accoustic microscopy to look for po
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