Industry News | 2019-08-19 15:02:03.0
YINCAE has successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package), particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process.
Eclipse Industries DS-107 Aligner Bonder The DS-107 Aligner Bonder is an ultra-high precision, high or low force aligner bonder. Constructed on a granite platform for superior stability and rigidity, the DS-107 is designed for alignment accuracy of
Bob Willis videos show you How to Do It each month. This month we talk about adhesion testing like copper foil, plated copper on PCBs or conformal coating adhesion to board assemblies. Adhesion testing can be used for many different materials and in
Industry News | 2010-05-11 15:23:38.0
To help electronics manufacturers be more productive and successful, the high complexity of the various steps in the SMT process chain requires that all participants develop innovative solutions jointly and as early as possible so that workflows can be simplified and improved.
Industry News | 2019-08-15 07:31:59.0
AXI is short for automated X-ray inspection, it's one of the most commonly used approaches for defect inspection in PCB Assembly.
ScanCOMPONENT is a PC-based offline component programming system for the creation of vision data files from the smallest flip chip and bumped packages to the largest odd form devices. The ScanCOMPONENT is a standalone Product as well as a module of
Features: 1. This machine selects the intelligent level sirocco and rapid infrared heating technology controlling, equipped with special design wind wheel, speed stability and uniform temperature, suit for uninterrupted soldering the LED and BGA com
Industry News | 2013-07-29 10:26:09.0
Technology webinars for the US time zone are being set up to help provided flexibility and also avoid engineers having to get up early in the morning. Bob Willis workshops in the US are supplemented with his on demand and online webinars.
New Equipment | Assembly Services
China Double Sided Circuit Boards Fabricaiton and Assembly PCBA Turnkey Manufacturer 2 Layers circuit boards PCB FR4 1.6mm PCB fabrication and assembly 1oz PCB copper thickness Shenzhen PCB and PCBA manufacturer China turnkey contract electroni
Industry News | 2009-09-17 16:43:33.0
TORRANCE, CA — September 2009 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, together with HIROX-USA, announces that it will highlight the HIROX series of digital microscopes at the IMAPS/NASA/JPL Topical Workshop & Exhibition on Counterfeit Electronic Parts; Awareness, Avoidance, Detection and Mitigation, scheduled to take place Thursday, October 1, 2009 at the Radisson Hotel in Los Angeles.
