Full Site - : avoid popcorn bga (Page 7 of 24)

Functional Test Faulure due to BGA ICs

Electronics Forum | Fri Jul 21 14:36:52 EDT 2006 | amol_kane

could also be a component issue...delamination/popcorning of the component....what is the MSL level?

BGA

Electronics Forum | Tue Dec 23 21:11:05 EST 2014 | slouis2014

The peak temp. during reflow is 285 degree, at this temperature, would popcorning already occur?Thanks

Re: Popcorn effect with PBGA

Electronics Forum | Tue Apr 11 09:45:45 EDT 2000 | emmanuel

Hi Kc, As recommended by the PBGA supplier, the temperature of the package surface should not exceed 225�C during 10 seconds max so as to avoid popcorn effect. Given that some of products reflow profils are specifiing reflow temperature at 250�C,

Re: Popcorning BGA in wave-soldering

Electronics Forum | Mon Oct 18 11:48:57 EDT 1999 | Dave F

No, but answer me this? 1 What type of BGA? 2 What's the wave process, materials and temps? Are you waving the BGA or top-side flowing it? 3 If the BGA is plastic, what are you doing to prevent/remove entrapped moisture before solder processing?

Re: Popcorn effect with PBGA

Electronics Forum | Wed Apr 05 13:59:56 EDT 2000 | Kal C.

Hi Emmanuel, There is lots of info. in SMTNet archive (I think 98 Sept-Dec). I had a lot of problem with PBGA and certain uBGA with their PCB base material (FR-X) and encapsulant. Wolfgang is correct. We had to reprofile our reflow oven , qualify an

Re: BGA Shorts?

Electronics Forum | Thu Feb 04 09:22:56 EST 1999 | Terry Burnette

| Hello all, | | Are BGA's easy to develope shorts? If a process is stable and all of a sudden you get BGA's shorting out on you, what might be problems? | | We've checked our solder paste amount, and we've rechecked our reflow profiles and nothin

Need Expert Support

Electronics Forum | Wed Mar 14 10:02:36 EST 2001 | blair

Boards were not immersion gold. They were HASL but I would like to change. What is the prefered surface fininsh for BGA and fine pitch stuff these days? I am starting to ask for Gold/Nickel on FAB Dwgs due to PCB house and assy house discussions.

BGA CORNER WARP

Electronics Forum | Tue Apr 24 12:05:56 EDT 2001 | pteerink

Robert, Were your parts in a sealed bag before use or were they exposed to the environment? If the parts have absorbed moisture, you might be seeing "popcorning" Phil

Re: Popcorning BGA in wave-soldering

Electronics Forum | Mon Oct 18 13:17:03 EDT 1999 | John Thorup

Are they visibly "popped" after wave but not before? Remember that many BGAs, especially plastic (PBGA) are very moisture sensitive and even 24 hours or less out of a controlled environment violates exposure rules.

BGA Solder Short

Electronics Forum | Mon Jul 17 11:21:05 EDT 2023 | stephendo

Fresh production run? As in starting with BGAs opened from the previous run? And then using BGAs that have been never opened? Look at the balls where the shorts are. They are smaller. You have delamination. I suspect that you have moisture in yo


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