Electronics Forum | Tue Oct 19 22:27:29 EDT 1999 | Stu Leech
We have just completed some studies of with ABPAC, who is a large subcontract assembler of plastic ball grid arrays. BT laminates can pick-up appreciable moisture in just two hours. They are using TVP demoisturizing, our product (I apologize for the
Electronics Forum | Fri May 21 13:57:02 EDT 1999 | KA Stillings
| | hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... | | | | your help is greatly appreciated...thanks | | | | omat marasigan | | | |
Electronics Forum | Tue Dec 23 07:49:10 EST 2014 | robertwillis
the most common reason can be popcorning of the device or warpage of the packages during reflow. the distacnce from the boatom of the device is decreased hence the solder shorts. Trying doing some measurements on the package during simulated reflow.
Electronics Forum | Thu May 20 03:34:56 EDT 1999 | Earl Moon
| hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... | | your help is greatly appreciated...thanks | | omat marasigan | | Omat baby, Mo
Electronics Forum | Mon Oct 21 08:46:15 EDT 2002 | davef
60% ||||36% of ball area|| >36% ||Class2|| Accept|| Reject ||||45% of ball diameter|| >45% ||||20.25% of ball area|| >20.25% ||Class3|| Accept|| Reject ||||30% of ball diameter|| >30% ||||09% of ball area|| >09% II. Missing Ball: This is prohi
Electronics Forum | Wed Nov 07 08:06:29 EST 2001 | hany_khoga
Dear All : 1- We assemble mixed technology boards. For some reasons, sometimes we store them semi assembled (only SMT). Knowing that they have plastic BGA,s , can the wave solder m/c affect or damage those BGA,S on continuation their production?
Electronics Forum | Mon Oct 14 18:27:38 EDT 2002 | kennyg
In regards to baking an assembly prior to hot air (BGA) rework.... 1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-br
Electronics Forum | Fri Aug 25 14:39:24 EDT 2006 | davef
1 When you peel the solder connection of a BGA, * If solder remains on the soldered surface [eg, component, substrate, etc], it's good. * If some solder remains and some base metal is present, it's marginal. * If no solder remains, it's NG. 2 Try I
Electronics Forum | Thu Mar 18 22:01:46 EST 1999 | Dave F
100 sec) and decrease reflow temp to 205C.
Electronics Forum | Tue Sep 01 02:50:40 EDT 1998 | karlin
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
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