Industry News | 2023-09-11 02:43:18.0
ViTrox, which aims to be the world's most trusted technology company, is thrilled to announce that we will be partnering with our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering SA de CV, to bring to you our Mexico Technology Day 2023. The event will occur on 6th October 2023, from 9.30 AM to 7.30 PM, at APODACA 1 ballroom, Crowne Plaza Aeropuerto Hotel, Monterrey, Mexico.
Industry News | 2023-10-16 12:30:46.0
With its inspection systems, Viscom offers electronics manufacturers worldwide comprehensive inspection coverage – from 3D SPI and 3D AOI to 3D AXI and 3D MXI. At SMTA Mexico, October 25–26, 2023 in Guadalajara, their networking will be a particular focus. Visitors to Booth #1517 can learn more about Viscom's digital platform vConnect, which has won a GLOBAL Technology Award in the "Software Production" category.
Industry News | 2018-11-14 16:08:30.0
Data I/O Corporation (NASDAQ: DAIO) announces that it received the 2018 Mexico Technology Award in the category of Programming for its UFS device programming support for automotive applications on the Lumen®X programming platform. The award was presented to the company on Wednesday, November 14, 2018 in a ceremony that took place during the SMTA Guadalajara Expo & Tech Forum. This marks the company’s fifth award for UFS programming technology.
Industry News | 2008-01-31 00:10:18.0
GREELEY, CO � January 29, 2008 � FCT Solder, a division of FCT Assembly, and Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., announce that it will exhibit SN100C� Lead-Free products paste in booth 213 at the upcoming IPC International Conference on Flexible Circuits, scheduled to take place February 12-14, 2008 in Phoenix, Ariz.
Industry News | 2004-02-04 16:03:13.0
The US Air Force projects it will turn a small $485,000 investment for four PinPoint II Testers, from Diagnosys, into $13-plus million in cost avoidance to re-host more than 100 previously developed software programs for repair of its AWACS fleet.
Industry News | 2017-04-07 15:01:40.0
Students, educators and institutes will get a discount on devices and accessories in the LCR-Reader Store. The discount will reflect the quantity purchased
Industry News | 2018-02-28 17:37:20.0
Data I/O Corporation announces that it has been awarded a 2018 NPI Award in the category of Programming for its UFS device programming support for automotive applications on the LumenX™ programming platform. The award was presented to the company during a Tuesday, Feb. 27, 2018 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.
Industry News | 2018-04-27 10:10:49.0
Data I/O Corporation announces that it has been awarded a 2018 EM Asia Innovation Award in the category of Programming for its UFS device programming support for automotive applications on the LumenX™ programming platform. The award was presented to the company during an April 25, 2018 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.
Industry News | 2018-10-07 20:05:41.0
Saki Corporation will present its new 3Di Automated Optical Inspection (AOI) system at the Fuji America booth #407, at SMTA International. Saki's AOI system plays a vital role in enabling M2M communication and helping to make the Smart Factory and Industry 4.0 a reality. Fuji Corporation is a supplier of surface mount technology pick-and-place solutions and has produced many innovations in the circuit board assembly world.
Technical Library | 2007-04-04 11:43:41.0
The present work offers a discussion and a first case study to identify and illustrate voiding mechanisms for a particular TIM between a heat spreader and the back of a flip chip. Pronounced differences were observed between stencil printing and dispensing in terms of initial void formation, apparently related to the specific properties of the material. Measurements of the effects of heat ramp rate and peak temperature showed the subsequent evolution and final void size distribution to be determined by the initial part of the cure profile up to the material gelling temperature.
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