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IPC Assembly Quality Benchmark Survey Open to Participants Worldwide

Industry News | 2019-04-24 18:56:07.0

The 2019 Study of Quality Benchmarks for Electronics Assembly, one of IPC’s most popular annual studies, is currently underway. The survey is online and available in both English and Mandarin Chinese. The deadline for participation is May 17.

Association Connecting Electronics Industries (IPC)

Backplane Assembly

Backplane Assembly

New Equipment |  

dataCon has designed and manufactured many of the current backplane technologies such as VME 64X, PCI, and VXI. We can provide substrate procurement (from one of our partner companies or the customer's approved supply base), press fit and solder asse

dataCon

Allchips Limited

Industry Directory | Distributor

Allchips is a professional electronic components supply chain service platform, supported by over 1000 original manufacturers & authorized agents, and more than 10,000,000 products data.

Altronics Manufacturing Inc

Industry Directory |

Electronic contract assembly of complex printed circuit boards (PCB), backplanes, RF, chassis, cables, press-fit connectors, and electro-mechanical assemblies. Services include: DFM, turn key, consignment, prototype, and quick turn. www.altronicsmfg.com

Press Fit Technology Roadmap and Control Parameters for a High Performance Process

Technical Library | 2016-10-27 16:24:23.0

Press-fit technology is a proven and widely used and accepted interconnection method for joining electronics assemblies. Printed Circuit Board Assembly Systems and typical functional subassemblies are connected through press-fit connectors. The Press-Fit Compliant Pin is a proven interconnect termination to reliably provide electrical and mechanical connections from a Printed Circuit Board to an Electrical Connector. Electrical Connectors are then interconnected together providing board to board electrical and mechanical inter-connection. Press-Fit Compliant Pins are housed within Connectors and used on Backplanes, Mid-planes and Daughter Card Printed Circuit Board Assemblies. High reliability OEM (Original Equipment Manufacturer) computer designs continue to use press-fit connections to overcome challenges associated with soldering, rework, thermal cycles, installation and repair. This paper investigates the technical roadmap for press fit technology, putting special attention to main characteristics such, placement and insertion, inspection, repair, pin design trends, challenges and solutions. Critical process control parameters within an assembly manufacturing are highlighted.

Flex (Flextronics International)

C-MAC Industries Inc.

Industry Directory | Manufacturer

Global Designer & manufacturer of advanced electronic components, modules, systems & contract assemb

Orbotech Announces New President

Industry News | 2003-01-27 09:36:56.0

Greater AOI Capabilities

Orbotech

ViTrox Technologies Releases High-Throughput AOI Solution — V510 G2 Series

Industry News | 2012-07-18 10:12:06.0

ViTrox Technologies,introduces the G2 Series of its V510 Advanced Optical Inspection (AOI) solution. The V510 G2 Series offers powerful technologies and high-throughput productivity for SMT line production.

ViTrox Technologies

PMC4U -4 UART channels with SCC

Industry News | 2001-12-14 15:08:35.0

Avail. for ordering at Dynamic Engineering

Dynamic Engineering

Solutions for Selective Soldering of High Thermal Mass and Fine-Pitch Components

Technical Library | 2020-05-07 03:46:27.0

The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.

SELECT Products | Nordson Electronics Solutions


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