Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Technical Library | 2009-12-09 19:47:15.0
For the mobile market some PCB assemblies have been converted to flex circuit assemblies, in part because flex circuit assembly can be twisted or bent per the application needs. Flex circuits offer the same advantages as conventional printed circuit boards: quality, reliability, and high density.
Industry News | 2005-03-18 12:10:43.0
New pick & place series FLX2010-MK (MK=Membrane Keyboard)
Industry News | 2018-10-18 11:09:41.0
Advantages of Design for Manufacturability Rules
Industry News | 2008-10-08 17:45:46.0
One of the most important international electronics manufacturing events in the Bohai Region of North China, BEW 2008, will open its doors from the 10th to 12th November at the Tianjin International Exhibition Center. Set to be bigger than ever, Reed Exhibitions China invites visitors to enjoy a roundup of products and services from the entire electronics manufacturing chain, from components and assembly technology, to quality control and subcontracting services. The event will again provide an excellent brand building platform on which to generate sales leads and bring trade professionals, buyers and decision makers together in one of the fastest growing markets in China.
Industry News | 2024-01-15 13:50:05.0
The Murray Percival Company is proud to represent Board Shark, a leading force in providing unparalleled quick-turn, competitive pricing, and innovative flex circuits solutions. This strategic partnership combines the Murray Percival Company's legacy of quality service and Board Shark's expertise in navigating the fast-paced PCB market, promising exceptional value to their clients.
Industry News | 2003-03-10 17:51:59.0
TiNiMIGHT Technology
Industry News | 2017-10-17 19:47:15.0
Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Hall A2 Booth 445 at productronica 2017, scheduled to take place Nov. 14-17, 2017 at the Messe München in Germany.
Industry News | 2017-11-08 15:24:31.0
Nordson DIMA, a division of Nordson Corporation (Nasdaq NDSN), will exhibit a range of products at Productronica, the world’s leading trade fair for electronics development and production, to be held in Munich, Germany, on November 14-17, 2017, in Hall A2, stands 345 and 578.
Industry News | 2016-10-11 19:03:14.0
Nordson MARCH received the 2016 Global Technology Award for its FlexTRAK®-CDS high-volume plasma system at a ceremony held in conjunction with the SMTA International conference in Rosemont, IL on September 27, 2016. The system removes contamination, etches surfaces to improve adhesion, and provides surface activation prior to die attach, wire bond, mold encapsulation, and underfill to lead frame strips, laminated substrates, and other strip-type electronic components.
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