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Flason SMT China Automatic Solder paste printer for SMT assembly line Factory Supplier

Flason SMT China Automatic Solder paste printer for SMT assembly line Factory Supplier

New Equipment | Printing

Flason SMT China Automatic Solder paste printer for SMT assembly line Factory Supplier Power Supply: AC:220±10%,50/60HZ Control Method: PC Control PCB Size/Max: 850*500mm Weight Approx:1300Kg Product description: China Automatic Solder

Flason Electronic Co.,limited

Flason SMT China Automatic Solder paste printer for SMT assembly line Factory Supplier

Flason SMT China Automatic Solder paste printer for SMT assembly line Factory Supplier

New Equipment | Printing

Flason SMT China Automatic Solder paste printer for SMT assembly line Factory Supplier Power Supply: AC:220±10%,50/60HZ Control Method: PC Control PCB Size/Max: 850*500mm Weight Approx:1300Kg Product description: China Automatic Solder

Flason Electronic Co.,limited

Reworkable Underfill for Package-on-Package (POP)

Industry News | 2009-09-17 17:02:12.0

EAST HANOVER, NJ – Zymet has introduced a new reworkable underfill encapsulant, CN-1728, designed to underfill Package-on-Package (POP) assemblies. Underfilled POP’s have greater difficulty in passing thermal cycle tests than underfilled BGA’s. Compared to earlier generation underfills, CN-1728 has a lower coefficient of thermal expansion and higher Tg, and better compatibility with flux residues, both of which contribute to its superior thermal cycle performance.

Zymet, Inc

ATE Spring Pin BGA Socket for Digital Camera Processor

Industry News | 2011-01-12 15:27:11.0

Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing digital camera processor - CBT-BGA-7005. The contactor is a stamped spring pin with 26 gram actuation force per ball and cycle life of 500,000 insertions.

Ironwood Electronics

iNEMI Publishes Guidelines for Subassemblies in High-Reliability Applications

Industry News | 2006-06-23 16:19:47.0

Group Addresses Assembly Process and Reliability Requirements for SnPb and Pb-free Modules

iNEMI (International Electronics Manufacturing Initiative)

New Underfill from Zymet for 0.4-mm pitch POP's

Industry News | 2012-01-13 13:20:53.0

Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.

Zymet, Inc

Tresky’s Product Technologies Provide High-Quality Solutions for Microelectronics

Industry News | 2013-06-20 19:31:51.0

Tresky, announces that its wide range of die bonder products from simple and inexpensive to fully automatic are designed to provide simple, precise and reliable solutions for many applications within the microelectronics industry.

Tresky AG

Inovar, Inc. Chooses Juki Again The Utah-based EMS Provider Placed an Order for Three KE-1080ENs for Its Growing Business

Industry News | 2013-01-28 08:44:23.0

Juki Automation Systems, announces that Inovar, Inc., a long-time Juki customer, recently purchased three KE-1080EN High-Speed Flexible Mounters

Juki Automation Systems

Brand new and original

Brand new and original

Videos

Contact Us Sales manager: Mac Xie Mobile: +8618020714662(WhatsApp) Email: at@mooreplc.com Skype: +8618020714662 Contact Us ✭Product  Overview✭ Ideal for Compression Systems, Speed Measurements, and Fluid-Film Bearing Machines Extended Temper

MOORE Automation Ltd.

Brand new and original

Brand new and original

Videos

Contact Us Sales manager: Mac Xie Mobile: +8618020714662(WhatsApp) Email: at@mooreplc.com Skype: +8618020714662 Contact Us ✭Product  Overview✭ Manufacturer : Bently Nevada Product No. : 330180-51-00 Product type : 3300XL Proximitor Sensor

MOORE Automation Ltd.


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