Industry News | 2011-03-03 11:50:19.0
GOEPEL electronic has developed special VarioTAP® IPs for testing VORTEX x86 chip series in cooperation with the Taiwanese Company DMP.
Industry News | 2014-07-15 14:38:39.0
Kyzen announces that it will exhibit AQUANOX® A4639 Electronic Assembly Aqueous Solution at the SMTA Philadelphia Expo & Tech Forum, scheduled to take place Tuesday, August 12, 2014 at the Crowne Plaza Philadelphia in New Jersey.
Industry News | 2013-04-10 15:58:24.0
Nordson YESTECH has been selected by Mer-Mar, Inc., a full-service contract electronics manufacturer, as their AOI supplier. Nordson YESTECH’s BX benchtop AOI will be used for automated inspection of printed circuit boards at Mer-Mar’s 22,000 square foot facility, located in Hesperia, California.
Industry News | 2012-02-03 13:29:38.0
Practical Components will feature its new Amkor PoP stacked packages, including the new TMV PoP, along with its full line of dummy component packages in Booth #538 at the upcoming IPC APEX Expo.
Industry News | 2012-09-17 16:26:16.0
Nihon Superior, has announced details of its participation in the Technical Program of SMTAI 2012
Technical Library | 2015-01-08 17:26:59.0
Regardless of the accelerating trend for design and conversion to Pb-free manufacturing, many high reliability electronic equipment producers continue to manufacture and support tin-lead (SnPb) electronic products. Certain high reliability electronic products from the telecommunication, military, and medical sectors manufacture using SnPb solder assembly and remain in compliance with the RoHS Directive (restriction on certain hazardous substances) by invoking the European Union Pb-in-solder exemption. Sustaining SnPb manufacturing has become more challenging because the global component supply chain is converting rapidly to Pb-free offerings and has a decreasing motivation to continue producing SnPb product for the low-volume, high reliability end users. Availability of critical, larger SnPb BGA components is a growing concern
Technical Library | 2022-10-31 17:09:04.0
The global transition to lead-free (Pb-free) electronics has led component and equipment manufacturers to transform their tin–lead (SnPb) processes to Pb-free. At the same time, Pb-free legislation has granted exemptions for some products whose applications require high long-term reliability. However, due to a reduction in the availability of SnPb components, compatibility concerns can arise if Pb-free components have to be utilized in a SnPb assembly. This compatibility situation of attaching a Pb-free component in a SnPb assembly is generally termed "backward compatibility." This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching Pb-free solder balls (SnAgCu) of a ball-grid-array component using SnPb paste. The experiment evaluates the Pb phase coarsening in bulk solder microstructure and the study of intermetallic compounds formed at the interface between the solder and the copper pad.
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