Electronics Forum | Mon Apr 14 12:40:28 EDT 2003 | jimcorr
They are letting you go on holiday with these problems outstanding??!! But seriously after reading about your problems I think that any further work is basically throwing good ��$$ after bad and reworking BGA almost always ensure that they will fail
Electronics Forum | Wed Feb 09 15:23:14 EST 2005 | GS
Hello, few comments: - what is the criteria to decide if re-ball or not a PBGA? - any electrical test is performed toPBGAs before reball ? - what in case the reballing has been done on a electrical damaged PBGA? In that case the replacement of
Electronics Forum | Fri Oct 29 07:35:42 EDT 2004 | Paddy
Hello all, I am looking at doing some trials with underfill under 1mm pitch BGA devices. Can anybody share any good / bad experience with this process ? Also I probably will not be in a position to procure automated equipment so are there any man
Electronics Forum | Wed Aug 04 20:06:24 EDT 2004 | C.W
Customer returned a brd claim that one of the FPGA is having "cold solder joint". I inspected the the BGA location with X-ray and Ersascope, balls' shape look fine, voids are not detected, perimeter joints show shinny and smooth appearance, i have se
Electronics Forum | Wed Oct 01 13:19:18 EDT 2008 | evtimov
I am also doing research on rework machines. for now I saw : Ersa - german http://www.ersa.de/en/produkte/smt_bga_rework/frame_smt_bga_rework.html DenOn- Japanese http://www.denondic.co.jp/en/products/rd500_2.html, Metcal http://www.metcal.com A
Electronics Forum | Fri Mar 08 09:27:43 EST 2002 | Amir
hello guys and gals: we know that BGA placement or rework are such a pain in *** oh well! but i was wonder if you can help me to figure: how many BGA do you place on board annualy? (just a bulk park idea) do you rework BGA in house? do you think
Electronics Forum | Fri Dec 10 08:42:37 EST 2004 | mattkehoe
We had some bad experiences trying to work with soldermask defined BGA pads. If the opening in the soldermask is right to the edge of the copper/pad without a space it can leave reside on the pad and nothing will stick to it. See http://www.sipad.com
Electronics Forum | Mon Nov 26 17:42:24 EST 2001 | davef
I agree. Voids in plating are bad news and baking will not change that.
Electronics Forum | Wed Sep 21 01:51:32 EDT 2005 | hly
Cognex board is bad. Waiting to get a replacement. Thanks for offering to help
Electronics Forum | Mon Mar 19 11:32:06 EST 2001 | Steve
Have you done any analysis on the failed rework? There could be any one of several reasons, i.e. bad alignment, wrong reflow profile, bad pad plating, etc. More information will help us help you.
