Electronics Forum | Wed Oct 11 09:23:06 EDT 2000 | Roger Squires
Has anyone had any success in finding open circuits (i.e. ball present but not soldered to PCB) under collapsible BGA's using an Agilent HP5DX x-ray tester and the BGA2 algorithm? Can anyone recommend an elongated pad design which produces the neces
Electronics Forum | Fri Jan 28 09:16:37 EST 2000 | Rene
The BGA-2000 is an old system thats correct ! I am a BGA-3500 user (the newest version)with windows software and a large underboard heather, i am verry happy with the system after using an APE wich was verry bad for my aplication. There is a posibili
Electronics Forum | Tue Sep 26 18:06:13 EDT 2006 | russ
could be black pad, or it is just bad reflow profile that did not get all balls soldered down. OR it could be a planarity issue between BGA and fab during assembly. Can we assume that this is proven design? Somewtimes in new design touching a BGA
Electronics Forum | Thu Feb 08 15:05:32 EST 2007 | realchunks
Wow, what a bunch of crabby old men. BGA opens can occur from pre,during or post process. I never chimmed in cause the original poster said they would performa a dye test. Yet as usual, they never get back to this forum on what the cause was. So
Electronics Forum | Sun Sep 07 09:57:23 EDT 2008 | davef
We have BGA connectors on rigid laminate. Points are: * We love BGA connectors for mating mother/daughter boards because they eliminate the wave solder step required for PTH connectors. * BGA connectors are very tricky to assemble, much trickier than
Electronics Forum | Wed May 02 10:45:24 EDT 2007 | bartlozie
I agree with Bob, Do you have a long TAL, ENIG needs a longer TAL then other boards, on the side of this, Latest year there are a lot of bad Au plated boards, we had 3 batch of bad plated boards in the last year. indeed maybe the problem isn't the
Electronics Forum | Wed Jan 13 22:01:42 EST 1999 | Dave F
| This question is directed to anyone having eperience with Sn62Pb36Ag2 solder balls for BGA's. | Have you seen anything like a rough, raisin-like surface texture after ball attach? If so, what did you do about it? | | Thanks! | Jenna: We've used
Electronics Forum | Fri Jun 10 14:22:53 EDT 2005 | pr
Are the local fids. necessary? Anyway, I can't think of any reason the local fids. would have to be spaced exactly the same distance from the part. We place BGA's and QFP's using board fids, and have yet to find a problem that local fids helped fix.
Electronics Forum | Fri Jan 17 09:38:20 EST 2003 | Grant Petty
Hi, We have a BGA that uses .4mm diameter PCB pads on the BGA itself, however we have decided to use .5mm pads on the PCB, to help paste release from the stencil. Is this a bad thing, having different size pads on the PCB compared to the BGA itself
Electronics Forum | Wed Jan 03 09:59:52 EST 2007 | Jim
Hi, I was looking for information on failure rates for BGA components. I am analyzing our BGA rework rates and find it difficult to define a root cause when a remove and replace of the BGA component corrects the test errors. Inspection prior to re
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